Card Aperture Peripheral Deformation for Module Anchoring
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Solution Overview
Problem
Existing methods for manufacturing electronic cards with integrated modules, such as digital displays, face challenges in precisely positioning these modules within the card and maintaining their position during the manufacturing process, especially when dealing with complex-shaped modules and batch production.
Innovation Solution
A method involving a frame or plate with apertures where localized pressure is applied to deform the peripheral area, creating a material connection between the module and the frame, ensuring precise positioning and anchoring of the electronic module within the aperture before adding a resin to secure it in place.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the electronic module is placed in a main aperture in a positioning frame using a binding agent, then the module can be integrated into the card, but the module may be moved slightly when the card is being formed and the binding agent may flow to form a layer that passes through the manufactured card
Solution Approach 1:
The patent applies preliminary action by deforming the peripheral area of the aperture before placing the electronic module into it. This deformation creates a mechanical interlock structure that prevents the module from moving during card formation, eliminating the need for binding agents and ensuring precise positioning from the outset.
Solution Approach 2:
The patent replaces the chemical binding mechanism (binding agent) with a mechanical interlock mechanism. The deformed peripheral area of the aperture creates physical anchors that mechanically secure the electronic module in place, substituting the unreliable chemical bonding system with a robust mechanical retention system.
2Manufacturing precision
If the dimensions of the main aperture are reduced to match the dimensions of the electronic module, then the module positioning is improved, but manufacturing tolerances make it difficult to achieve a tight fit
Solution Approach 1:
The patent applies local quality by deforming only the peripheral area of the aperture while leaving the main aperture dimensions unchanged. This localized deformation creates anchoring structures at the edges without requiring the entire aperture to be precisely sized, accommodating manufacturing tolerances while still achieving secure module retention.
3Ease of operation
If the electronic module is kept free in relation to the positioning frame until the card is formed, then the module can be easily handled, but precautions must be taken to ensure the module remains in the corresponding aperture
Solution Approach 1:
The patent applies preliminary action by pre-deforming the peripheral area of the aperture to create a mechanical interlock structure before the module is placed. This preliminary preparation ensures that once the module is positioned, it is automatically retained without requiring continuous precautions or monitoring during the card formation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise placement and secure anchoring of electronic modules during card manufacturing, facilitating the integration of complex modules and reducing handling issues, thereby improving the quality and consistency of the final product.
Implementation Method 1
at least one part of the peripheral area of said at least one aperture is deformed or crushed by the application of pressure, localised at this at least one part of the peripheral area, on said frame or said plate
Implementation Method 2
at least one part of the peripheral area of said at least one aperture is deformed or crushed by the application of pressure
Implementation Method 3
a material connection is established between said at least one zone of said electronic module and said at least one part of the peripheral area of said frame or said plate
Data Source
AI summary
Method of manufacturing at least one card each including an electronic module (2), this method providing a frame (14) or a plate (18) having at least one aperture (16) provided for receiving said electronic module. It is characterized in that at least one part of the peripheral area of said at least one aperture is deformed or crushed by localized application of pressure to said at least one part of the peripheral area on the frame or plate, so as to reduce locally the thickness of the frame or plate in said at least one part of the peripheral area, in that the electronic module is brought opposite the corresponding aperture so that at least one zone of the electronic module is superposed on said at least one part of the peripheral area, and in that a material connection is established between said at least one part of the peripheral area and said at least one corresponding zone of the electronic module for assembling said electronic module to the frame or plate before a resin is added at least on one side of the electronic module in a subsequent step of the method.