Printed Circuit Assembling TRIZ Cases

Inner cross-linking cures elastomeric plastic to encapsulate conductive particles, preventing electrical shorts.

Separating main and MIMO antennas with a coaxial cable reduces interference in mobile terminals, allowing thinner designs and improved signal quality.

A clamp secures electronic components on a PCB without soldering or adhesive.

An intelligent power module increases creepage distance for high voltage reliability by placing an isolation lead between power and other leads.

A printed wiring board design uses embedded base plating layers to form high-density bumps without sequential laser opening.

A head holding member uses a negative-pressure chamber to securely hold plural-nozzle heads via suction force.

Asymmetric second wiring pattern overlaps the second electrode in plan view to enable reliable bonding irrespective of device orientation.

A wiring unit with bent bus bar terminals engages a molding die to position conductive members accurately.

Silane-modified epoxy resin and polyol-isocyanate additives resolve the contradiction between chemical resistance and thermal stability during soldering.

Segmented internal electrodes in multilayer ceramic capacitors reduce direct current resistance through uniform current distribution.

Cover layer on flexible wiring terminals prevents solder contact, eliminating electrostatic discharge risks for miniaturized magnetic heads.

A circuit board assembly inspection method measures solder layer geometry to categorize joints and reduce manual review needs.

Supplementary alignment marks on flexible printed circuit boards enable precise positioning during assembly with display panels.

A backside-illuminated image sensor fabrication method bonds a first glass substrate to the re-distribution layer for mechanical support during thinning.

Individual magnets beneath each component align anisotropic conductive adhesive particles to reduce thermal stress and improve connection yields.

Alternating signal and ground bumps shield traces, reducing crosstalk and eliminating neckdowns for consistent impedance.

Mounting similar capacitors on opposite board faces cancels piezoelectric noise and electrical interference.

Segmenting thick copper into stacked electroplated layers reduces material usage and etching time while maintaining high current carrying capacity.

Guide portion and inclined inner wall align rod-shaped terminals, preventing inclination and ensuring stable electrical connectivity.

A printer mask holding section rotates the mask about a vertical axis to align openings with a parallel cleaning movement.

Nested circuit boards and spiral inductive coils reduce device height and volume while maintaining high performance.

Inverting the stiffener to the substrate bottom decreases warpage by 21% and cuts shock failures by 68%.

Automated replacement mechanisms detach the holder from the base section, resolving the trade-off between cleaning effectiveness and maintenance complexity.

Decreasing internal pressure draws solder back into the nozzle while gas cuts the stream, preventing dripping.

Suction device positions solder balls in mask apertures to form uniform bumps, resolving height inconsistencies from mechanical deformation.

An extended heat slug conducts thermal energy away from the source contact surface while establishing the electrical path for the power amplifier.

Bracket eliminates stacked PCB disassembly by securing mezzanine cards via side contact and top rails, reducing service time.

Direct bonding of convex electrodes to upright wiring board edge contacts.

Merging the circuit board and base into one unit reduces camera module volume while embedding components for better protection.

A layered anisotropic conductive film uses binder resin viscosity control to separate conductive particles in the thickness direction.

A rigid-flexible printed circuit board uses segmented flexible and rigid layers with pre-cut holes to form a compact multi-substrate structure.

Core obstructing structures on bonding structures prevent conductive particle overflow, enabling reduced frame width while maintaining electrical connectivity.

A vehicle camera motherboard features a tiltable secondary section that adjusts the optical axis angle via a pivot mechanism.

Diced aluminum slugs replace stamped copper spreaders, eliminating flatness defects and boosting yield while lowering junction temperatures.

Exposed PCB contacts on the rear surface of a SATA connector housing enable direct visual inspection of electrical connections.

Segmented architecture separates sensitive processing components from washable textile substrates, preventing water damage while maintaining connectivity.

Direct wire bonding to round conductors on flexible substrates eliminates lead frames and hazardous chemical etching processes.

A wiring board embeds pads in insulating layer recesses with controlled surface roughness to enhance solder wettability and adhesion.

Standardized command transmission eliminates reprogramming when replacing work-element apparatuses, reducing system complexity.

Localized pressure deforms aperture peripheries to mechanically anchor electronic modules, resolving positioning precision challenges during manufacturing.

Disposable photoresist patterns replace mechanical caps to align light-emitting devices, eliminating dust contamination and reducing manufacturing costs.

A mask with slots guides inkjet printing to form precise circuits, avoiding metal splashes and oxidation from direct laser engraving.

An elastically deformable suction part minimizes chip bending and air entrapment by allowing air escape during vacuum pick-and-place operations.

Thicker lower dielectric layers in a multi-layer ceramic capacitor reduce piezoelectric reaction forces and acoustic noise on printed circuit boards.

Varying PCB trace widths compensates for manufacturing tolerances to minimize signal reflection and improve impedance stability.

Epoxy resin encapsulation with adhesion-promoting surfaces prevents corrosion and mechanical damage in transmission oil.

Heating silver and bismuth particles above the bismuth melting point enables rapid high-temperature semiconductor bonding without glass frit.

Embedding bond pads within dielectric layers and applying cover metal barriers prevents delamination and solder wetting issues.

Material volume contact elements on a strip carrier maintain consistent LED pitch intervals, preventing uneven illumination when concatenating modules.