Integrated Electrical Support for Compact Camera Modules
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Solution Overview
Problem
Conventional camera modules face challenges with size enlargement due to protruded conductors, vulnerability to external factors, and inadequate protection, which complicates manufacturing and reduces product quality and lifespan.
Innovation Solution
A camera module with an integrated electrical support that combines the functions of a circuit board and base, eliminating the need for a separate base, using conductive adhesives for motor mounting and flip chip methods for light-sensitive chip attachment, and embedding electronic components for enhanced protection and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional CSP or COB technology is used with components placed on the surface of the circuit board, then each electronic component can be properly mounted, but the camera module size increases and cannot meet the lightness and thinness requirements
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional stacked architecture. Electronic components are arranged in multiple layers vertically above the circuit board, with the light-sensitive chip positioned at the bottom layer and other components stacked above it. This vertical stacking enables compact camera module dimensions while maintaining all necessary component functions.
Solution Approach 2:
The patent implements nested arrangement where electronic components are positioned within the vertical space above the circuit board. The light-sensitive chip is placed at the bottom, with other components nested above it in a stacked configuration, effectively utilizing the third dimension to reduce overall module footprint.
2Reliability
If a separate base is used to protect internal components and support the motor, then component protection is provided, but the camera module size increases
Solution Approach 1:
The patent merges the base and circuit board into a single integrated structure. The circuit board serves dual functions as both the electrical connection substrate and the mechanical support base. This integration eliminates the need for a separate base component, reducing part count and camera module size while maintaining protection and support functions through the stacked component arrangement.
Solution Approach 2:
The circuit board is designed to perform multiple functions: providing electrical connections, serving as a mechanical support base, and enabling vertical stacking of components. This multi-functional design replaces the need for separate base and circuit board components, achieving compactness without sacrificing protection or support capabilities.
3Reliability
If protruded conductors are used to electrically connect the motor to the circuit board, then electrical connection is achieved, but the manufacturing process becomes complicated and product quality is influenced
Solution Approach 1:
The patent extracts the protruded conductor from the motor assembly and replaces it with a soldering-based electrical connection method. The motor is directly soldered to the circuit board or to intermediate structures, eliminating the need for protruding conductors that complicate the manufacturing process and affect product quality.
Solution Approach 2:
The patent replaces the mechanical protruded conductor connection system with a soldering-based electrical connection system. This substitution simplifies the manufacturing process by eliminating the need for precise mechanical alignment and insertion of protruded conductors, while providing more reliable electrical connections through direct solder joints.
4Length of moving object
If the camera module components are arranged in a conventional manner, then functionality is maintained, but the thickness and compactness requirements cannot be met
Solution Approach 1:
The patent arranges all necessary camera module components in a vertical stacked configuration above the circuit board. The light-sensitive chip is positioned at the bottom layer, with other electronic components stacked above it. This three-dimensional arrangement maintains full functionality while achieving the required compactness and thinness for portable electronic devices.
Solution Approach 2:
The patent segments the camera module into distinct functional layers: the light-sensitive chip at the bottom, followed by other electronic components stacked above, with the optical lens positioned separately. This segmentation allows each component to be optimized for its function while achieving compact overall dimensions through vertical arrangement.
Data Source
AI summary
A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.