Solder Supply Device Pressure Control and Gas Cutting
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Solution Overview
Problem
Solder supplied from dispensing nozzles tends to droop and drip due to its viscosity, even after cutting, which existing solder cutting devices only partially address, leading to unreliable prevention of solder dripping.
Innovation Solution
The solution involves decreasing pressure inside the housing case when solder supply is stopped and using a solder cutting device that ejects gas to cut the solder, ensuring simultaneous cutting and retraction of the solder into the nozzle, along with a dispensing nozzle design that allows gas to be ejected circumferentially to effectively cut and twist the solder, preventing dripping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is cut by a solder cutting device after supply is stopped, then solder dripping is prevented to a certain degree, but solder droops from the cut surface and the cutting reliability is insufficient
Solution Approach 1:
The patent applies preliminary action by decreasing the pressure inside the housing case before the solder cutting operation. Specifically, when the supply of solder from the dispensing nozzle is stopped, the pressure inside the space is decreased first, which causes the solder to be drawn back into the dispensing nozzle. Only after this retraction occurs is the solder cutting device operated to cut the solder by ejecting gas. This sequence ensures that the solder is retracted before cutting, preventing drooping from the cut surface and achieving reliable dripping prevention.
2Productivity
If pressure is stopped being increased inside the housing case, then solder supply is stopped, but solder droops and drips from the tip of the dispensing nozzle due to viscosity
Solution Approach 1:
The patent applies preliminary action by decreasing the pressure inside the housing case immediately when solder supply is stopped. This pressure decrease occurs before any cutting operation, causing the solder to be drawn back into the dispensing nozzle. This preliminary retraction action prevents the solder from drooping and dripping due to its viscosity, addressing the harmful effect before it can manifest.
Solution Approach 2:
Instead of maintaining positive pressure to prevent drooping, the patent inverts the approach by decreasing the pressure inside the housing case when supply is stopped. This negative pressure change draws the solder back into the nozzle, counteracting the viscous drooping tendency through an opposite pressure differential rather than continued positive pressure.
3Object-generated harmful factors
If gas is ejected to cut the solder, then solder dripping is reduced, but solder droops from the cut surface
Solution Approach 1:
The patent applies preliminary action by decreasing the pressure inside the housing case before the solder cutting operation. This pressure decrease causes the solder to be drawn back into the dispensing nozzle before the gas ejection cutting occurs. As a result, when the solder is cut by the ejected gas, there is no excess solder drooping from the cut surface, because the solder has already been retracted into the nozzle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reliably prevents solder dripping by cutting and retracting the solder simultaneously, ensuring it does not escape from the nozzle, and the nozzle design ensures effective cutting and containment of the solder, preventing scattering and external spillage.
Implementation Method 1
the solder cutting device is operated to cut the solder by ejecting gas
Implementation Method 2
pressure inside the space is decreased when supply of solder from the dispensing nozzle is stopped... drawing back of solder drooping from the dispensing nozzle inside the dispensing nozzle
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Solder supply device 26 is provided with solder cup 70 housing liquid solder that is tubular and open at one end, a positive/negative pressure supply device capable of controlling the pressure inside the solder cup, supply nozzle 74 for dispensing solder from the solder cup, and solder cutting device 77 that cuts solder supplied from the supply nozzle by ejecting compressed air; solder is supplied from the supply nozzle by increasing the pressure inside the solder cup using the positive/negative pressure supply device; when stopping the supply of solder from the supply nozzle, the pressure inside the solder cup is decreased using positive/negative pressure supply device, and solder is cut by the solder cutting device to match the timing of pressure inside the solder cup decreasing. Thus, because cutting of solder at the supply nozzle and drawing back of solder into the supply nozzle are performed at the same time, dripping of solder is reliably prevented.