Elastically Deformable Suction Part for Semiconductor Chip Bonding
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Solution Overview
Problem
Conventional pneumatic chip bonding tools cause semiconductor chips to bend and trap air bubbles when picking and placing thin chips, leading to reliability and performance issues in stacked packages due to pressure differences and adhesive voids.
Innovation Solution
A suction bonding tool with an elastically deformable chip contacting surface, featuring a combination of flat and convex regions with strategically distributed openings for vacuum communication, reduces chip bending and air trapping by allowing air escape during placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a conventional pneumatic chip bonding tool is used to pick and place thin semiconductor chips, then the chip can be lifted and positioned, but the chip bends and air bubbles are trapped between the chip and substrate due to pressure differences
Solution Approach 1:
The patent changes the physical state of the suction part from rigid to elastically deformable, allowing it to dynamically adapt its shape during chip handling. This parameter change enables the suction part to conform to the chip surface during placement, preventing air bubble entrapment while maintaining effective vacuum pickup
Solution Approach 2:
The suction part is designed to be dynamically deformable rather than static, allowing it to change shape in response to applied forces. During chip placement, the elastically deformable material compresses to allow air escape, then returns to its original shape to maintain vacuum seal, providing adaptive behavior throughout the pick-and-place cycle
2Strength
If vacuum suction is applied to lift the chip, then the chip can be held securely, but the pressure difference causes the chip to bend during placement
Solution Approach 1:
The suction part transitions from a rigid structure to an elastically deformable one, changing its mechanical parameters to allow compression during placement. This enables the suction part to maintain vacuum holding force while accommodating chip shape changes without causing permanent deformation
Solution Approach 2:
The elastically deformable material acts as a cushion that absorbs the mechanical stress during chip placement. The material's elasticity provides a compliant interface that prevents force transmission to the chip that would cause bending, while still maintaining sufficient vacuum pressure for secure holding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tool effectively minimizes chip deformation and air entrapment, enhancing the reliability and performance of semiconductor chip stacks by ensuring uniform adhesion and preventing adhesive voids and air bubbles.
Implementation Method 1
a suction part (2) made of an elastic material... a shank (3) having a vacuum conduit (4)... openings (5) through the curved surface (7) in pneumatic communication with the vacuum conduit (4)
Implementation Method 2
the suction causes the chip to bend owing to the difference between the ambient (atmosphere) pressure and the pressure within the tool created by the vacuum
Implementation Method 3
a suction part (2) made of an elastic material... the region of the suction part adjacent the chip contacting surface (the deformable zone) is made of an elastically deformable conductive or non-conductive material
Data Source
AI summary
A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.