Flexible Circuit Board Alignment Using Supplementary Marks
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Solution Overview
Problem
Existing display apparatus manufacturing methods face challenges in precisely aligning and attaching flexible printed circuit boards to display panels, leading to potential electrical connectivity issues and reduced precision in the assembly process.
Innovation Solution
The use of supplementary alignment marks on flexible printed circuit boards, which are etched into the insulating layer, allows for precise alignment with corresponding marks on the display panel, enabling accurate attachment and electrical connection through anisotropic conductive films, ensuring reliable electrical contact between pads on the substrate and the flexible printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional alignment methods are used to attach flexible printed circuit boards to display panels, then the manufacturing process is simple, but the alignment precision and electrical connectivity reliability are insufficient
Solution Approach 1:
The patent applies preliminary action by pre-defining multiple alignment marks (first alignment marks on the display panel and second alignment marks on the flexible printed circuit board) before the attachment process. These marks are positioned in advance to guide the alignment operation, ensuring precise positioning without requiring complex real-time adjustment mechanisms during assembly.
Solution Approach 2:
The patent introduces anisotropic conductive films as an intermediary layer between the flexible printed circuit board and the display panel. This intermediary not only facilitates electrical connection through its conductive properties but also serves as a positioning medium that works in conjunction with the alignment marks to achieve precise alignment during the attachment process.
2Reliability
If traditional attachment methods are used, then the manufacturing process is straightforward, but electrical connectivity reliability is reduced
Solution Approach 1:
The anisotropic conductive films serve as a mediator that simultaneously provides electrical conductivity and mechanical bonding. This intermediary layer ensures reliable electrical connections between the flexible printed circuit board and the display panel while maintaining ease of manufacture through a standardized attachment process that combines positioning and electrical connection in one step.
Solution Approach 2:
The alignment marks are preliminarily positioned on both the display panel and the flexible printed circuit board before attachment. This preliminary positioning action ensures that when the components are assembled, the electrical connections are automatically aligned with high reliability, eliminating the need for complex post-assembly adjustments.
3Manufacturing precision
If precise alignment is achieved through multiple marks and anisotropic conductive films, then electrical connectivity is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The alignment marks are preliminarily defined during the manufacturing of the display panel and flexible printed circuit board separately. This preliminary action allows the precise positioning information to be built into the components themselves, enabling rapid and accurate assembly without requiring complex alignment procedures during the manufacturing process, thus maintaining high productivity.
Solution Approach 2:
The anisotropic conductive films act as a mediator that simplifies the attachment process by combining positioning and electrical connection functions in a single step. Although the structure is more complex, the manufacturing process becomes more efficient because the intermediary layer enables automated assembly with high precision, improving overall manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the precision and reliability of attaching flexible printed circuit boards to the display panel, ensuring effective electrical connectivity and improved manufacturing efficiency by using supplementary alignment marks and anisotropic conductive films.
Implementation Method 1
a plurality of anisotropic conductive films provided between the first regions of the first substrate and the second regions of the flexible printed circuit boards. The first pads on the first regions and the second pads on the second regions may be electrically connected to each other through the anisotropic conductive films.
Data Source
AI summary
A display apparatus may include a display panel and a plurality of flexible printed circuit boards connected to the display panel. The display panel may include first regions arranged in a first direction and may include a plurality of first alignment marks, which are respectively provided on the first regions and are arranged in the first direction. Each of the flexible printed circuit boards may include a plurality of second alignment marks arranged in the first direction and overlapped with the first alignment marks, an insulating layer spaced apart from the second alignment marks in a second direction crossing the first direction, and a plurality of supplementary alignment marks spaced apart from the second alignment marks by a first distance in the second direction, the supplementary alignment marks being openings defined in the insulating layer.