Function Panel Core Obstructing Structure for Narrow Frame Displays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current narrow frame display devices face challenges in achieving a slim overall design due to the need for wide bonding structures to ensure electrical connections, which results in increased frame widths, especially for upper and lower frames, affecting user experience and visual effect.
Innovation Solution
A function panel with conductive structures and bonding structures on a base substrate, featuring core obstructing structures like pore-like or protruding structures that prevent conductive particle overflow in anisotropic conductive films, allowing for reduced bonding structure length and width, thereby minimizing the overall frame width of the display device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding structures are made wide to ensure electrical connections, then electrical connectivity is improved, but frame width increases
Solution Approach 1:
The bonding structure is segmented into multiple components: conductive structures, bonding structures with core obstructing structures, and anisotropic conductive films. This segmentation allows each component to perform its specific function efficiently, enabling reduced overall frame width while maintaining reliable electrical connections through the structured arrangement of these segments
Solution Approach 2:
Core obstructing structures are strategically placed at specific locations within the bonding structures where conductive particle overflow occurs. This local quality enhancement targets the critical overflow zones without requiring overall enlargement of the bonding structures, thus maintaining narrow frame width while ensuring reliable electrical connectivity at key interfaces
2Length of stationary object
If bonding structure length is reduced to minimize frame width, then frame width decreases, but electrical connection reliability may be compromised
Solution Approach 1:
The invention changes the dimensional parameters of the bonding structures by introducing core obstructing structures that define specific width and height dimensions. These parameter changes allow the bonding structures to be compact (reducing frame width) while the core obstructing structures maintain the necessary electrical connection reliability by controlling conductive particle distribution within the reduced space
Solution Approach 2:
Anisotropic conductive films serve as intermediaries between the conductive structures and bonding structures. These films enable electrical connection reliability to be maintained even with reduced bonding structure dimensions, as the ACF fills and conforms to the core obstructing structures, ensuring reliable electrical contact without requiring large bonding structure areas
3Manufacturing precision
If core obstructing structures are added to prevent conductive particle overflow, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
Core obstructing structures utilize pore-like or cavity structures that naturally control conductive particle overflow through their geometric configuration. This porous or cavity-based approach improves manufacturing precision by passively containing particles within defined spaces, while the repetitive modular nature of these structures across multiple bonding locations actually reduces overall device complexity compared to custom solutions for each bonding area
Data Source
AI summary
A function panel, a manufacturing method thereof and a display device are provided. The function panel is in the display device, and includes: a base substrate, a plurality of conductive structures and a plurality of bonding structures on the base substrate, the plurality of conductive structures being connected with the plurality of bonding structures in one-to-one correspondence; and a core obstructing structure being provided on each of the bonding structures for obstructing overflow of conductive particles in an anisotropic conductive film. By providing the core obstructing structure on the bonding structure, the core obstructing structure can obstruct overflow of the conductive particles in the anisotropic conductive film. After the display device is formed, an overall width of the frame of the display device can be reduced effectively.