Stacked Circuit Board Structure for Thick Copper Current Carrying
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Solution Overview
Problem
Conventional circuit board manufacturing methods require time-consuming mechanical processes and large amounts of copper material for thick copper areas, limiting efficiency and feasibility of single-sided wiring.
Innovation Solution
A circuit board structure comprising a core layer with electroplating metal layers connected through dielectric layers, allowing for the formation of a thick copper area capable of carrying large currents without extensive mechanical processing, using a manufacturing method that includes half-etching, dielectric paste filling, and electroplating to build up metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a whole thick copper plate is used as the core board to achieve thick copper area, then the current carrying capacity is improved, but the amount of copper material required increases significantly
Solution Approach 1:
The patent divides the thick copper structure into multiple thin copper foil layers (first copper foil layer, second copper foil layer, third copper foil layer) separated by dielectric layers. This segmentation allows achieving the required current carrying capacity through stacked thin layers rather than using a single thick copper plate, thereby reducing overall copper material consumption while maintaining electrical performance.
Solution Approach 2:
The patent transitions from a planar thick copper structure to a three-dimensional stacked structure with multiple copper foil layers separated by dielectric layers. This dimensional change enables current to flow through multiple parallel paths in the vertical direction, achieving equivalent or superior current carrying capacity with less total copper material.
2Reliability
If a thick copper plate is used, then the current carrying capacity is improved, but the etching time for insulating areas increases
Solution Approach 1:
By segmenting the thick copper structure into multiple thin copper foil layers, the patent reduces the thickness that needs to be etched for each layer. This allows the etching process to be completed much faster for each individual thin layer compared to etching through a single thick copper plate, thereby reducing total etching time while maintaining current carrying capacity.
3Ease of manufacture
If mechanical processing is used to manufacture circuits, then circuit patterns are created, but the manufacturing process becomes time-consuming
Solution Approach 1:
The patent replaces traditional mechanical drilling and routing processes with electroplating technology to create conductive vias and copper traces. Instead of mechanically removing material to create circuits, the invention uses electrochemical deposition to build up conductive structures, significantly reducing manufacturing time and enabling more complex circuit patterns.
Solution Approach 2:
The patent changes the fundamental manufacturing parameter from mechanical removal (drilling/routing) to electrochemical addition (electroplating). This parameter change enables faster manufacturing by depositing copper through electroplating processes rather than mechanically removing material, thereby reducing overall manufacturing time while achieving precise circuit patterns.
4Adaptability or versatility
If conventional methods are used, then double-sided wiring is achieved, but single-sided wiring manufacturing is not possible
Solution Approach 1:
The patent structures the circuit board as stacked thin copper foil layers separated by dielectric layers, with each layer being independently processable. This segmentation allows the first and second copper foil layers to be manufactured and connected through electroplated vias, while the third copper foil layer can be added later for single-sided or double-sided wiring configurations, providing manufacturing flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces copper material usage, eliminates time-consuming mechanical processing, and enables the production of thick copper circuit boards that can carry large currents while allowing for single-sided manufacturing.
Implementation Method 1
at least one electroplating metal layer is disposed on at least one of the first surface and the second surface of the core layer
Implementation Method 2
At least one conductive metal layer is disposed in at least one opening of at least one dielectric layer and is correspondingly connected to at least one electroplating metal layer
Data Source
AI summary
A circuit board structure includes a core layer, at least one electroplating metal layer, at least one dielectric layer and at least one conductive metal layer. The core layer includes at least one dielectric portion and at least one metal portion. The electroplating metal layer is disposed on at least one of a first surface and a second surface of the core layer, exposing a portion of at least one of the first surface and the second surface and at least connecting the at least one metal part. The dielectric layer is disposed on at least one of the first surface and the second surface and on the electroplating metal layer. The dielectric layer has at least one opening exposing a portion of the electroplating metal layer. The conductive metal layer is disposed in the opening of the dielectric layer and is correspondingly connected to the electroplating metal layer.