Convex Electrode Bonding for Image Pickup Apparatus Reliability
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Solution Overview
Problem
Conventional CSP-type image pickup apparatuses face challenges in bonding reliability and external dimension due to the use of flexible pattern films and T-shaped multilayer ceramic wiring boards, which affect the size and length of the device.
Innovation Solution
The image pickup apparatus features convex electrodes on the image pickup device's opposing surface directly bonded to edge electrodes on an upright wiring board, enhancing bonding reliability and reducing the device's length by eliminating the need for intermediate members and simplifying the wiring board configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible pattern film is used to electrically connect electrodes to the wiring board, then electrical connection is achieved, but bonding reliability deteriorates and device length increases
Solution Approach 1:
The invention extracts and eliminates the flexible pattern film from the bonding structure. Instead of using the pattern film as an intermediate connector, the wiring board is directly bonded to the convex electrodes on the image pickup device, removing the source of reliability issues and length extension
Solution Approach 2:
The invention merges the previously separate components (pattern film, wiring board, and electrode connections) into a direct bonding structure. The wiring board is directly attached to the convex electrodes, combining the electrical connection function and mechanical support into a single integrated bonding interface
2Ease of manufacture
If a T-shaped multilayer ceramic wiring board is used, then electrical connection and component mounting are achieved, but device complexity and length increase
Solution Approach 1:
The invention extracts and removes the complex T-shaped multilayer ceramic structure, replacing it with a simplified wiring board configuration that maintains electrical connection functionality without requiring multiple layers or T-shaped geometry
Solution Approach 2:
Instead of making the wiring board complex (T-shaped, multilayer) to achieve proper connections, the invention inverts the approach by making the image pickup device structure adapt to a simpler wiring board, with convex electrodes positioned to directly bond with the simplified board structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves bonding reliability, reduces the device's length, and allows for easier signal cable bonding, while maintaining high manufacturing simplicity and stability, with convex electrodes made of solder ensuring secure bonding.
Implementation Method 1
the plurality of convex electrodes include first convex electrodes and second convex electrodes, the first convex electrodes are bonded to the first edge electrodes, the second convex electrodes are bonded to the second edge electrodes
Data Source
AI summary
An image pickup apparatus includes: an image pickup device including a plurality of convex electrodes disposed on an opposing surface; and a wiring board including a plurality of first edge electrodes on a first main surface and a plurality of second edge electrodes on a second main surface, wherein the wiring board is disposed in an upright state on the opposing surface, the plurality of convex electrodes include first convex electrodes and second convex electrodes, the first convex electrodes are bonded to the first edge electrodes, the second convex electrodes are bonded to the second edge electrodes, and the wiring board is held between the first convex electrodes and the second convex electrodes.