Semiconductor Device Terminal Guide for Perpendicular Alignment
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Solution Overview
Problem
Existing semiconductor devices face issues with external connection terminals that incline, leading to improper fixation and electrical connection with printed-circuit boards due to the lack of effective guidance and alignment mechanisms during assembly.
Innovation Solution
The semiconductor device incorporates a rod-shaped external connection terminal with a guide portion and an inclined inner wall in the insertion hole of the lid plate, ensuring perpendicular alignment and secure fixation by utilizing a guide portion fixed to the side of the terminal and an inclined inner wall within the insertion hole.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the contact part slightly inclines, then the external connection terminal is fixed in an inclined state, but the external connection terminal cannot be properly connected to the printed-circuit board
Solution Approach 1:
The guide portion is formed on the external connection terminal in advance during manufacturing, so that when the terminal is inserted into the insertion hole, the guide portion automatically guides it into the correct perpendicular position before final insertion. This preliminary structural preparation ensures proper alignment without requiring complex assembly procedures.
Solution Approach 2:
The guide portion acts as an intermediary element between the external connection terminal and the insertion hole. It mediates the insertion process by providing a tapered surface that gradually guides the terminal into the correct position, transforming the insertion action from a direct fit into a guided alignment process.
2Device complexity
If no guide portion is provided, then the structure is simpler, but the external connection terminal cannot maintain proper perpendicularity during insertion
Solution Approach 1:
The insertion hole is divided into two functional zones: an upper portion with a guide portion that provides alignment guidance, and a lower portion that receives the external connection terminal. This segmentation allows each zone to perform its specific function - the guide portion ensures perpendicularity while the lower portion provides stable reception.
Solution Approach 2:
The guide portion is localized to the upper part of the insertion hole where alignment is needed, while the lower part maintains a simple cylindrical structure for stable reception. This local differentiation of structural quality ensures perpendicularity guidance exactly where needed without unnecessarily complicating the entire insertion hole structure.
Data Source
AI summary
A semiconductor device, including a substrate having an insulating plate and a conductive plate formed on the insulating plate, a semiconductor chip formed on the conductive plate, a contact part arranged on the conductive plate with a bonding member therebetween, a rod-shaped external connection terminal having a lower end portion thereof fitted into the contact part, and a lid plate having a front surface and a back surface facing the substrate. An insertion hole pierces the lid plate, forming an entrance and exit respectively on the back and front surfaces of the lid plate. The external connection terminal is inserted in the insertion hole. The semiconductor device has at least one of a guide portion with an inclined surface, fixed to a portion of the external connection terminal located in the insertion hole, or an inclined inner wall of the insertion hole.