Cardo Polyamideimide Primer for Reflow-Stable Semiconductor Bonding

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional resin materials used in semiconductor devices face challenges in maintaining adhesion between components during high-temperature heat cycle testing and reflow steps, leading to potential device failure due to inadequate heat resistance and adhesive strength.

Innovation Solution

A polyamideimide resin composition with a cardo structure fluorene skeleton is developed, which forms a primer layer that enhances adhesion between semiconductor device members by achieving a glass transition temperature of 300°C or higher, thereby improving heat resistance and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the glass transition temperature of the resin sealing material is increased to improve heat resistance, then adhesion at high temperatures is improved, but the resin becomes harder and detachment occurs during moisture absorption reflow testing

Engineering Contradiction:

Improveglass transition temperatureVSAvoidadhesion during moisture absorption reflow testing

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The invention changes the chemical composition parameters of the polyamideimide resin by incorporating specific structural units (cardo structure fluorene, trimellitic anhydride, disiloxane diamine) to achieve a glass transition temperature of 250°C or higher while maintaining appropriate flexibility and adhesion properties

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses a composite resin system combining polyamideimide resin with specific structural units, solvents, and coupling agents to achieve both high heat resistance and maintained adhesion during reflow processing

Inventive Principle:

Principle #40Composite materials

2Temperature

If conventional resin materials are used in heat cycle testing at higher drive temperatures, then device operation is maintained, but detachment occurs between component members leading to device failure

Engineering Contradiction:

Improvedrive temperatureVSAvoidadhesion between component members

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The invention modifies the resin material parameters by developing a polyamideimide resin with glass transition temperature of 250°C or higher, which maintains adhesion between component members during heat cycle testing at elevated drive temperatures exceeding 200°C

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The high-heat-resistant polyamideimide resin acts as an intermediary material between component members (such as between the resin sealing layer and substrate or semiconductor element) to prevent detachment during thermal cycling

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentEP4026867B1Polyamideimide resin, resin composition, and semiconductor device

Publication Date: 2023.12.06 RESONAC CORP

Figure 1

AI summary

A polyamideimide resin containing a structural unit (Ia) represented by a formula shown below, and a structural unit (IIa) represented by a formula shown below. In the formula (Ia), each X independently represents a hydrogen atom, or at least one substituent selected from the group consisting of halogen atoms, alkyl groups of 1 to 9 carbon atoms, and alkoxy groups and hydroxyalkyl groups of 1 to 9 carbon atoms. In the formula (IIa), each R independently represents a hydrogen atom or at least one substituent selected from the group consisting of alkyl groups of 1 to 9 carbon atoms, alkoxy groups of 1 to 9 carbon atoms and halogen atoms, and n represents an integer of 1 to 6.