Component Carrier Cavity Laser Drilling Depth Control
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Solution Overview
Problem
Existing methods for manufacturing component carriers with deep cavities face challenges such as high surface roughness, low accuracy in depth control, and width, which are critical for applications like RF waveguides.
Innovation Solution
A component carrier with a stack of layers forming electrically conductive and insulating structures, featuring a conically shaped cavity with inclined side walls and recesses, manufactured using laser drilling and multiple release layers to achieve precise control over cavity depth and width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If conventional laser drilling is used to create deep cavities, then cavity depth can be increased, but surface roughness increases and manufacturing precision deteriorates
Solution Approach 1:
The cavity formation process is segmented into multiple sequential laser drilling steps, each creating a portion of the total cavity depth. This segmentation allows control over surface roughness at each stage while achieving the required total depth through cumulative material removal.
Solution Approach 2:
A preliminary conical cavity structure is formed first with controlled surface roughness, followed by subsequent processing steps that refine the cavity to achieve the final smooth-walled cylindrical geometry required for waveguide applications.
2Length of stationary object
If conventional laser drilling is used for deep cavities, then cavity depth can be increased, but depth control accuracy and width precision deteriorate
Solution Approach 1:
The laser drilling process incorporates feedback mechanisms including real-time monitoring of drilling parameters, adaptive control of laser power and pulse duration, and verification of cavity dimensions at intermediate stages to maintain depth control accuracy and width precision throughout the deep cavity formation process.
Solution Approach 2:
The laser drilling parameters are dynamically adjusted during the process based on depth progression, with different power levels, pulse frequencies, and beam focal positions applied at different stages to maintain precision while achieving the required cavity depth.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of component carriers with high surface quality and accurate depth and width control, suitable for deep cavities used as RF waveguides, while ensuring reliable and cost-effective manufacturing.
Implementation Method 1
forming a cavity within said stack by removing material... by means of a laser beam for removing material to form the cavity
Data Source
Figure 1
Figure 2
Figure 3~6
AI summary
The invention relates to a component carrier (1) comprising a stack (2) of a plurality of layers (12) forming at least one electrically conductive layer structure (3) and at least one electrically insulating layer structure (4), said stack (2) comprising a - preferably conically shaped - cavity (5), wherein the cavity (5) extends - in the direction (D) perpendicular to the planes (P) in which the layers (12) extend - through at least two layers (12) of the plurality of layers, said cavity (5) being delimited by a side wall (6), said side wall (6) being inclined with respect to the direction (D) perpendicular to the planes (P) of the layers (12), wherein at least one recess (7) is provided in the side wall (6) of said cavity (5), said recess (7) locally disrupting the side wall extension and partially extending in the stack (2) along the planar extension of the stack (2).