Printed Circuit Aspects TRIZ Cases

A composite epoxy resin combines rigid aromatic rings with flexible alkylene chains to enhance thermal conductivity and substrate adhesion.

Circuit board cavities accommodate components on opposite sides, decoupling thermal management and eliminating expensive connectors.

Vertical stacked PCBs with integrated capacitors reduce voltage deviations during high current transients without consuming board space.

An edge stiffener structure overlaps the peripheral PCB edge to enhance bending and twisting stiffness, mitigating breakage in thinned boards.

Visible markers on flexible circuits identify wire conductor connections, reducing assembly and service times in complex vehicle electrical systems.

Displacement plating deposits a second metal layer on the first metal layer, enhancing conductivity and reliability without additional catalyst layers.

Glass sandwich processing allows thin touch sensor panels to bypass minimum thickness limits of existing handling equipment.

A wiring structure routes conductors along inclined inner walls of a reservoir forming substrate to connect terminals on opposing plates.

Electroless plating replaces electroplating in multilayer inductors, eliminating thickness deviation and un-plated regions that compromise DC resistance.

A flexible printed circuit board applied to a high thermal conductivity base body enables three-dimensional shaping for compact electronic control units.

Segments analog front end and digital signal processor into separate chiplets to isolate heat interference while lowering manufacturing costs.

Segmented metal plating with a diffusion barrier layer prevents tin whisker growth while maintaining low contact resistance and durability.

Mechanical stamping forms precise copper wires before lamination, preventing undercutting and reducing chemical waste.

A method forms fine conductive patterns by landing liquid droplets on a recess to fill an adjacent narrow groove via capillary action.

A metal core printed circuit board dissipates heat from a heating element to a substrate, reducing thermal damage to adjacent components.

A flexible wiring board uses conductive yarns woven into a knit fabric substrate to provide electrical pathways within textile structures.

Prepreg pockets embed functional components directly into laminate structures, eliminating via formation steps and reducing manufacturing costs.

Roughened resin substrate surface embeds organic hydroxyl groups to anchor metal plating layers.

Exposed lead wire ends align with substrate terminals to eliminate labor-intensive soldering and reduce manufacturing costs.

Applying conductive material before assembly eliminates precise positioning requirements, simplifying the connection process for hybrid insulating elements.

A planar electronic device incorporates a substrate vent opening to fluidly connect the component recess to the atmosphere.

A stamped contact tail with a paddle-shaped distal portion shapes conductive adhesive into a secure joint.

A flexible printed circuit board connects rigid portions to isolate heat between electric elements while enabling high-speed communication.

A 3D printing system deposits UV-curable dielectric material mixed with low CTE filler to form tailored layers.

Segmented ground contacts with resilient springs engage PCB card edges to isolate differential signal pairs within the connector housing.

Method forms first openings in insulating layers and second openings in metal supporting boards to prevent short circuits during electrolytic plating.

Nano-copper solder fills via holes to improve heat dissipation while preventing traditional solder outflow during processing.

Pulse width modulation controls the needle valve to eliminate dripping and enable precise application on densely populated PCBs.

Polygonal backlight module minimizes bezel width in circular displays by extending side plates closer to the panel.

An etching process forms inner circuit layers and vias simultaneously, reducing manufacturing steps for odd-layer printed circuit boards.

A ceramic insulator layer with three sub-layers uses differential sintering temperatures to constrain shrinkage and prevent conductor diffusion.

Flexible planar support material is slit into strips bearing mounted electronic devices to form functional yarns.

Laser drilling segments cavity formation to control depth and width, reducing surface roughness in deep RF waveguide structures.

Integrated connection portions in stacked plate wiring members allow arbitrary electrical connections without increasing device complexity.

Partition walls between adjacent internal terminals constrain solder flow to prevent bridges while ensuring adequate fillet size for reliable connections.

Elastic elements enable reversible snap-fit connections between component carriers, eliminating soldering and allowing easy repair without mechanical damage.

Widened conductive traces and discontinuous structural islands enable simultaneous bonding of multiple flexure tail bond pads.

Conductive vias plated in dielectric holes couple the buzzer directly to the circuit, eliminating heat damage and contamination from flux.

A split ground plane on a printed circuit board acts as a dipole antenna to enable UHF RFID communication without adding extra component area.

Rigid mylar carrier device maintains thermal pad structural integrity during operation while enabling efficient heat transfer through a conductive window.

Dual-pressure lamination fills voids in the first dielectric layer while smoothing the second layer to prevent warpage and image transfer.

Spatially varied heat sink fin arrangements match local thermal loads to prevent overheating while minimizing manufacturing complexity.

Rectangular asymmetric pads minimize pad area while maintaining bonding strength, resolving the trade-off between wiring flexibility and thermal conductivity.

A heat transfer assembly uses raised thermal pedestals to conduct heat from optical modules through circuit board apertures.

Opposing currents in planar windings cancel leakage flux, resolving the trade-off between compact size and signal reliability.

Inclined pins on flexible circuit boards compensate for polyimide expansion and contraction, ensuring accurate pin alignment and improving display panel yield.

Integrating contact pads into bonding pad areas reduces PCB size while Schottky diodes manage electrostatic discharge risks.

Nesting a power inductor inside a tracker module recess reduces overall system size while maintaining independent component design and heat dissipation.

A printed circuit board uses a dielectric layer and controlled plating to connect a heat dispersion coin.