Pattern Forming Method Using Groove and Recess Structure
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Solution Overview
Problem
Existing methods for forming fine conductive patterns on base materials, such as lithography, are limited by the size of the liquid droplets used, restricting the minimum width of the patterns that can be achieved and increasing production costs due to the need for multiple steps and large, expensive equipment.
Innovation Solution
A method involving the formation of grooves and liquid-receiving sections on the base material, where the liquid-receiving sections have dimensions larger than the grooves, allowing liquid droplets to flow into the grooves via capillary action, enabling the creation of patterns with finer widths without being restricted by the droplet diameter, and potentially using a liquid-repellent film to prevent outflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If lithography method is used to form conductive patterns, then manufacturing precision can be improved, but device complexity and production cost increase due to multiple steps and large equipment
Solution Approach 1:
The base material is segmented into regions with different surface properties: a liquid-repellent section and a liquid-attractive section. This segmentation allows the liquid conductive material to be automatically directed into the groove without requiring complex lithography equipment or multiple process steps, thereby reducing device complexity while maintaining manufacturing precision.
Solution Approach 2:
The patent replaces the mechanical lithography system with a surface energy-based liquid direction system. By creating regions with different liquid repellency, the system uses capillary action and surface tension forces to guide the liquid conductive material into the groove, eliminating the need for complex mechanical lithography equipment and multiple process steps.
2Ease of manufacture
If direct liquid jetting into grooves is used, then production cost can be reduced, but manufacturing precision deteriorates because pattern width cannot be smaller than droplet diameter
Solution Approach 1:
The patent introduces a liquid-repellent section as an intermediary region between the liquid source and the groove. This intermediary section with high liquid repellency acts as a barrier that prevents liquid from spreading outside the groove, allowing precise pattern formation even when using larger liquid droplets. This enables manufacturing precision to exceed the droplet diameter limitation.
Solution Approach 2:
The base material is given different local qualities: the liquid-repellent section has high liquid repellency while the liquid-attractive section has low liquid repellency. This local differentiation of surface properties allows the liquid conductive material to be precisely confined to the groove area, enabling fine pattern width control without requiring small droplet diameters, thus reducing production cost while improving manufacturing precision.
3Manufacturing precision
If liquid-repellent film is added to prevent liquid outflow, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The liquid-repellent section serves multiple functions: it prevents liquid outflow from the groove, guides liquid direction through capillary action, and defines the pattern boundary. By combining these functions into a single structural element rather than adding separate components, the patent improves manufacturing precision without proportionally increasing device complexity.
Solution Approach 2:
The patent merges the liquid-repellent barrier function with the base material structure itself. The liquid-repellent section is integrated into the base material as a functional region rather than being a separate added component. This merging approach prevents liquid outflow and improves manufacturing precision while minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the easy formation of conductive patterns with narrower widths and reduced production costs by leveraging capillary forces to fill narrow grooves with liquid, simplifying the process and eliminating the need for precise droplet landing on the groove itself.
Implementation Method 1
forming a liquid-repellent film on a surface of the base material... the liquid-repellent film having a liquid repellency higher than a liquid repellency of an inner surface of the groove
Implementation Method 2
the liquid flowing into the groove... leveraging capillary forces to fill narrow grooves with liquid
Data Source
Figure 1
Figure 2
Figure 3A~3G
AI summary
A groove and a recess are formed on one surface of a base material, the recess being communicated with the groove and having a width and a length longer than a width of the groove. After that, liquid droplets are landed on the recess to charge a liquid into the groove communicated with the recess. Further, the liquid charged into the groove is solidified. Accordingly, the liquid can be charged into the groove having the narrow width, by merely landing the liquid droplets on the recess having a large areal size. Therefore, a fine pattern can be easily formed on the base material.