Hybrid Insulating Elements for Printed Circuit Board Manufacturing
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Solution Overview
Problem
Existing methods for manufacturing printed circuit boards face challenges in precisely positioning and connecting different elements with varying insulating material properties, requiring complex steps and precise alignment for proper electrical and mechanical connections.
Innovation Solution
A method involving insulating materials with different mechanical, chemical, or physical properties, where elements are coupled on adjacent surfaces and covered with conductive material, eliminating the need for precise positioning and vias, and allowing a core substrate with defined regions for simplified connection and layer buildup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flexible material comprising conductor pattern is inserted into recesses of rigid part after rigid part is provided with conductors, then electrical connection between flexible and rigid elements is achieved, but precise positioning and additional via structures are required which increase device complexity and manufacturing difficulty
Solution Approach 1:
Conductive material is applied to the rigid part before the flexible element is inserted into the recess. This preliminary application of conductive material eliminates the need for precise via alignment and complex positioning structures, as the conductive material can be applied in advance and will automatically contact the flexible element's conductors upon insertion.
Solution Approach 2:
The method extracts and eliminates the need for via structures and precise positioning mechanisms by applying conductive material directly to the rigid part's surface. This removes the complexity of creating holes, plating vias, and ensuring precise alignment between flexible and rigid elements.
2Reliability
If via structures are provided to allow contact between flexible and rigid elements, then electrical connection is established, but manufacturing precision requirements increase due to small dimensions of conductors
Solution Approach 1:
Conductive material is applied to the rigid part before assembly, allowing the conductors to be in place beforehand. This eliminates the need for high-precision via drilling and plating operations that would otherwise be required to establish electrical contact after assembly.
Solution Approach 2:
The mechanical via structure (holes, plating, precision alignment) is replaced by a simpler conductive material application process. Instead of requiring precise mechanical formation of vias and alignment, the conductive material can be applied more tolerantly and will still achieve electrical contact.
3Adaptability or versatility
If different parts of insulating material are combined to produce hybrid printed circuit board, then design flexibility is improved, but connection difficulty increases due to need for precise positioning and electrical contact between different layouts
Solution Approach 1:
Conductive material is applied to the rigid part before the flexible element is assembled. This allows different insulating material parts with different layouts to be connected more easily, as the conductive material is already in place to establish electrical contact without requiring precise positioning during assembly.
Solution Approach 2:
The conductive material acts as an intermediary that facilitates connection between different parts with different layouts. Instead of requiring precise mechanical and electrical alignment between dissimilar components, the conductive material provides a tolerant interface that achieves both mechanical support and electrical contact.
Data Source
AI summary
A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps:providing at least two elements (1, 3) of insulating materialcoupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surfacecovering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surfacebuilding up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material,wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties.Furthermore a printed circuit board (10) or sub-assembly thereof is provided.