Variable Density Heat Sink Fins for Circuit Board Thermal Management

The patent applies local quality by dividing the circuit board into different regions (first region, second region, third region) with different heat dissipation requirements. Heat dissipation fins are selectively arranged in different patterns in each region: dense arrangement in high-heat regions, sparse arrangement in low-heat regions, and no fins in low-heat regions. This ensures that each region receives appropriate heat dissipation capacity matched to its actual heat generation characteristics, improving overall heat dissipation efficiency while avoiding unnecessary complexity in low-heat areas.

The patent implements local quality by selectively placing heat dissipation fins only in regions where they are needed. The first region (high heat generation) receives dense fin arrangement, the second region (medium heat generation) receives medium-density fins, and the third region (low heat generation) receives no fins. This selective approach ensures adequate heat dissipation capacity where required while simplifying manufacturing in regions where fins would be unnecessary, thereby reducing overall manufacturing complexity and cost.

The patent applies local quality by implementing dense heat dissipation fin arrangement only in the first region where heat generation is high, medium-density arrangement in the second region, and no fins in the third region where heat generation is low. This spatially differentiated approach ensures that space is consumed by fins only where actually needed for heat dissipation, maximizing the available space for other components in regions with lower thermal requirements.