UV-Curable Dielectric 3D Printing for CTE-Tuned PCBs
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Solution Overview
Problem
The manufacture of multi-layer printed circuit boards (PCBs) is cost and time intensive, and existing technologies struggle to efficiently produce PCBs with the required thermal expansion properties.
Innovation Solution
A 3D printing system that uses UV-curable dielectric materials and low CTE fillers to create a CTE-tuned dielectric layer, combined with conductive ink printing, to form multi-layer PCBs with predefined thermal expansion characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional multi-layer PCB manufacturing methods are used, then PCBs with required thermal expansion properties can be produced, but the manufacturing process is cost and time intensive
Solution Approach 1:
The patent adjusts the coefficient of thermal expansion (CTE) by varying the composition and concentration of filler particles within the dielectric material. By changing the parameter of filler content, the CTE can be tuned to match specific requirements, enabling precise thermal expansion control through material composition adjustment rather than traditional manufacturing processes
Solution Approach 2:
The patent employs composite dielectric materials consisting of a base polymer matrix combined with various filler particles (such as glass beads, ceramic particles, or metal flakes). This composite structure allows the material to achieve desired thermal expansion properties while maintaining electrical insulation characteristics, resolving the contradiction between precision thermal control and manufacturing efficiency
2Manufacturing precision
If traditional multi-layer PCB manufacturing methods are used, then PCBs with required thermal expansion properties can be produced, but manufacturing time is excessive
Solution Approach 1:
The patent adjusts the coefficient of thermal expansion (CTE) by varying the composition and concentration of filler particles within the dielectric material. By changing the parameter of filler content, the CTE can be tuned to match specific requirements, enabling precise thermal expansion control through material composition adjustment rather than traditional manufacturing processes
Solution Approach 2:
The patent replaces traditional mechanical layering and bonding processes with direct inkjet printing of dielectric layers containing embedded filler particles. This substitution of mechanical manufacturing with a deposition-based approach significantly reduces manufacturing time while maintaining precise control over thermal expansion properties through material formulation
3Ease of manufacture
If UV-curable dielectric materials with low CTE filler are used, then manufacturing cost is reduced, but material composition precision must be controlled
Solution Approach 1:
The patent pre-mixes the filler particles with the UV-curable dielectric material before printing, creating a homogeneously dispersed composite ink. This preliminary mixing action ensures consistent material composition and uniform filler distribution, eliminating the need for complex in-process composition control while maintaining manufacturing precision and reducing overall manufacturing cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D printing system enables the efficient and cost-effective production of multi-layer PCBs with tailored thermal expansion properties, reducing manufacturing time and costs while enhancing performance.
Implementation Method 1
UV curable dielectric materials for 3D printing and 3D printing systems with the same
Data Source
AI summary
A 3D printing system includes a reservoir for a UV-curable dielectric material in communication with a first nozzle configured to print the UV-curable dielectric material onto a substrate and a reservoir for a low CTE filler in communication with a second nozzle configured to print the low CTE filler onto the substrate, and a reservoir for a conductive ink in communication with a third nozzle configured to print the conductive ink onto the substrate. The 3D printing system prints the UV-curable dielectric material and the low CTE filler such that the printed low CTE filler mixes with the printed UV-curable dielectric material and forms a UV-curable dielectric layer with the low CTE filler dispersed therein.