Circuit Board System With Component Cavities
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Solution Overview
Problem
Conventional circuit board systems face challenges with plug-in technology being expensive and space-consuming, while soldered connections limit operating temperature and increase failure probability at higher temperatures.
Innovation Solution
The circuit board system incorporates cavities in one or more circuit boards to accommodate electronic components on both sides, allowing for decoupled cooling and connection via land grid array (LGA) or ball grid array (BGA), eliminating the need for expensive connectors and optimizing space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plug-in connections are used to connect circuit boards, then the system can operate at higher temperatures and has higher reliability, but the cost increases and space requirements increase
Solution Approach 1:
The patent merges the connector and the circuit board into a unified structure where the connector is integrated directly onto the circuit board substrate. This eliminates the need for separate plug-in connectors while maintaining the electrical connection functionality, thereby reducing space requirements while preserving reliability
Solution Approach 2:
The circuit board design incorporates multiple functions into a single structure: the board itself serves as both the electrical connection medium and the mechanical support structure. The integrated connector design allows the same structure to provide both electrical connectivity and structural alignment, reducing the need for additional components
2Area of stationary object
If soldered connections are used to connect circuit boards, then the space requirements are reduced, but the operating temperature range is limited and failure probability increases at high temperatures
Solution Approach 1:
The patent segments the connection system into distinct functional zones: soldered connections are used for low-stress, low-temperature components, while plug-in connectors are reserved for high-power components that generate heat. This segmentation allows each connection type to be optimized for its specific function, maintaining space efficiency while ensuring reliability at high temperatures where needed
3Device complexity
If all electronic components are arranged on one side of the circuit board, then the layout is simpler, but the space requirements increase and thermal management becomes less efficient
Solution Approach 1:
The patent transitions from a two-dimensional single-sided layout to a three-dimensional multi-layer configuration. Components are distributed across multiple layers of the circuit board, with vertical stacking and through-hole connections enabling efficient use of board volume. This dimensional transition reduces the footprint area while maintaining manageable layout complexity through systematic layer design
4Device complexity
If all electronic components share a common heat sink, then the structure is simpler, but the thermal management efficiency decreases when components have different thermal requirements
Solution Approach 1:
The patent applies different thermal management characteristics to different regions of the circuit board. High-power components with high thermal requirements are equipped with dedicated heat sinks or thermal vias, while low-power components share communal thermal paths. This local differentiation optimizes thermal management efficiency for each component's specific needs while maintaining overall structural coherence
Data Source
AI summary
According to an aspect of the present disclosure, there is provided a circuit board system including: a main board having a top side and a bottom side, wherein the main board has at least one cavity on its top side; a printed circuit board, PCB having a top side and a bottom side; and at least one first electronic component arranged on the top side of the PCB, and at least one second electronic component arranged on the bottom side of the PCB, wherein the PCB is arranged on the top side of main board, and wherein the at least one second electronic component on the bottom side of the PCB extends into the cavity on the top side of the main board.