Embedded Component Circuit Board Core via Prepreg Pockets

The patent applies preliminary action by forming conductor layers and functional component layers simultaneously during the circuit board manufacturing process, before final assembly. The functional components are embedded within the circuit board structure with their terminals directly connected to conductor layers through lamination, eliminating the need for subsequent via formation and plating steps that would otherwise be required to establish electrical connections.

The patent merges multiple manufacturing operations into a single lamination process. The functional component layers, containing embedded components with terminal extensions, are laminated directly to the core material with conductor layers in one step. This combines the embedding, electrical connection, and structural integration operations that would otherwise require separate via formation, plating, and assembly steps, thereby reducing manufacturing cost.

The patent applies preliminary action by pre-forming the functional components with extended terminals and embedding them within the circuit board structure during the manufacturing process itself, rather than as a post-processing step. The conductor layers are simultaneously formed and laminated to these extended terminals, establishing electrical connections before final board assembly, thereby eliminating subsequent via formation requirements.

The patent merges the electrical connection method with the embedding process itself. The functional components are integrated into the laminate structure with their terminals extending into contact with conductor layers, and the electrical connection is established through the lamination process that bonds the functional component layers to the core material. This unified approach achieves high volumetric efficiency while simplifying the overall manufacturing process compared to separate embedding and connection operations.