Carrier Device for Thermal Pad Structural Integrity

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Solution Overview

Problem

Conventional thermal pads in information handling systems become soft and malleable during operation, compromising their structural integrity and leading to improper placement, which can result in excessive temperatures and potential damage to components, affecting system reliability and user experience.

Innovation Solution

A carrier device with a rigid mylar material and double-sided adhesive surfaces is introduced, featuring a thermal transfer window and conductive core to securely couple a thermal pad to a component and a printed circuit board, allowing for efficient heat transfer and grounding while maintaining the pad's structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a thermal pad is used directly without a carrier device, then the device structure is simple, but the thermal pad becomes soft and malleable during operation, compromising structural integrity and leading to improper placement

Engineering Contradiction:

Improvedevice structureVSAvoidstructural integrity

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

A rigid carrier device is introduced as an intermediary between the thermal pad and the component surface. The carrier device maintains the structural integrity of the thermal pad assembly while allowing the thermal pad to perform its heat dissipation function. The carrier device includes alignment features that ensure proper placement and prevent the thermal pad from deforming during operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a rigid carrier device is introduced to maintain structural integrity, then reliability improves, but device complexity increases

Engineering Contradiction:

Improvestructural integrityVSAvoiddevice structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The carrier device is designed to perform multiple functions simultaneously: it provides structural support to maintain thermal pad integrity, includes alignment features for proper placement, incorporates conductive cores for grounding, and has adhesive surfaces for secure attachment. By consolidating these functions into a single component, the overall device complexity is minimized while achieving high reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If the thermal pad is securely coupled to the component, then thermal transfer efficiency improves, but the thermal pad cannot be reused on different components

Engineering Contradiction:

Improvethermal transfer efficiencyVSAvoidreusability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The thermal management system is segmented into three separable components: the reusable carrier device, the thermal pad, and the component surface. The carrier device with its adhesive surfaces securely couples the thermal pad to the component during operation, ensuring efficient thermal transfer. When replacement is needed, the entire carrier device-thermal pad assembly can be removed and replaced as a unit, allowing the thermal pad to be effectively reused on different components without compromising thermal contact.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The carrier device ensures reliable thermal distribution and grounding, preventing temperature-related damage and enabling the reuse of the thermal pad across different components, thus enhancing system reliability and user experience.

Implementation Method 1

the thermal pad configured to absorb a heat generated by the first component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a first adhesive surface coupled to the thermal pad... and a second adhesive surface removably coupled to the second surface of the second component

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11832378B2Carrier device for a thermal pad of an information handling system

Publication Date: 2023.11.28 DELL PROD LP

AI summary

In one embodiment, a carrier device for a thermal pad of an information handling system includes: a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component; a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system; and a second adhesive surface removably coupled to the second surface of the second component.