Wiring Structure for Liquid Droplet Ejecting Head with Inclined Surface Routing
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Solution Overview
Problem
The existing liquid droplet ejecting heads face difficulties in forming wirings with a sufficient pitch between nozzles or terminals due to the inclined surface on which wirings are formed, making it challenging to decrease the pitch between nozzles or wirings for higher definition image formation or microdevice manufacturing.
Innovation Solution
A wiring structure is developed with a base substrate and a wiring substrate bonded through a through portion with inclined inner walls, allowing for extended wiring lengths and a sufficient pitch between wirings, which are electrically connected using conductive members and bumps, enabling reliable and precise electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the pitch between terminals of piezoelectric elements is decreased to achieve higher definition, then the definition of image formation or wiring manufacturing is improved, but the pitch between wirings becomes insufficient making it difficult to form the wirings
Solution Approach 1:
The patent transitions from forming wirings only on the lateral surface to forming wirings on both the lateral surface and the upper surface of the reservoir forming substrate. This dimensional extension allows wirings to be routed through multiple surfaces, increasing the available path length and enabling sufficient pitch between wirings even when terminal pitch is reduced.
Solution Approach 2:
The wiring formation process is divided into multiple stages: first forming wirings on the lateral surface, then forming additional wirings on the upper surface. This segmentation allows each wiring layer to be optimized independently, ensuring adequate spacing while maintaining connection to reduced-pitch terminals.
2Manufacturing precision
If the pitch between nozzles is decreased to achieve higher definition, then the definition of image formation is improved, but the wiring structure becomes more complex and difficult to manufacture
Solution Approach 1:
By utilizing both the lateral surface and upper surface for wiring formation, the patent distributes the wiring complexity across multiple surfaces rather than concentrating it on a single lateral surface. This dimensional distribution simplifies the wiring structure by providing alternative routing paths and reducing interference between adjacent wirings.
3Ease of manufacture
If the pitch between wirings is increased to ensure sufficient spacing, then the manufacturability of wirings is improved, but the overall size of the liquid droplet ejecting head increases
Solution Approach 1:
The patent uses the upper surface of the reservoir forming substrate as an additional dimension for wiring routing. This allows wirings to achieve sufficient spacing by traveling across the upper surface rather than requiring increased lateral separation, thereby maintaining compact device dimensions while ensuring manufacturable wiring pitch.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures a sufficient pitch between wirings, facilitating the formation of reliable liquid droplet ejecting heads and apparatuses with reduced size and improved precision, enabling higher definition image formation and microdevice manufacturing.
Implementation Method 1
a plurality of piezoelectric elements which respectively change pressure in the plurality of pressure generation chambers
Data Source
AI summary
A liquid droplet ejecting head includes a vibrating plate on which terminals are formed, a reservoir forming substrate which is bonded to the vibrating plate and has a through portion having an inclined surface at an acute angle with respect to the vibrating plate as an inner wall, a substrate which is located on an opposite side to the vibrating plate through the reservoir forming substrate, is bonded to the reservoir forming substrate, and has terminals formed thereof, an IC package which is mounted on the substrate and is electrically connected to the terminals of the substrate, and wirings which are formed on the inclined surface and electrically connect the terminals on the vibrating plate and the terminals on the substrate.