Nano-copper Via Fill for PCB Thermal Conductivity

The patent changes the physical and chemical parameters of the filling material by using nano-copper particles instead of traditional solder. The nano-copper particles have different melting characteristics and thermal conductivity properties, allowing them to be melted at lower temperatures (improving fill reliability) while providing superior thermal conductivity (improving heat dissipation). This parameter change resolves the contradiction between reliable filling and thermal performance.

The patent creates a composite structure by combining nano-copper particles with a binder material. This composite approach allows the filling material to exhibit both the low-temperature melting behavior needed for reliable processing and the high thermal conductivity required for effective heat dissipation. The composite material simultaneously addresses both the reliability and thermal conductivity requirements.

The patent extracts the essential function of thermal conduction from the complex electroplating process and achieves it through a simpler alternative. Instead of relying on time-consuming copper plating, the invention uses nano-copper particle filling that can be processed more quickly while achieving comparable or superior thermal conductivity. This extraction of the core function resolves the time-reliability contradiction.

The patent replaces the durable but time-consuming electroplating process with a faster, though potentially less permanent, nano-copper filling approach. The nano-copper particles provide sufficient thermal conductivity for the application's lifespan without requiring the extended processing time of traditional plating. This trade-off resolves the contradiction between process speed and thermal connection reliability.