Component Carrier Dielectric Lamination Warpage Control

The patent divides the dielectric layer into two separate layers: a first dielectric layer applied at high pressure to fill voids and improve mechanical stability, and a second dielectric layer applied at lower pressure to prevent image transfer and maintain surface flatness. This segmentation allows each layer to serve its specific function without the adverse effects of high pressure on the final surface quality.

Different pressure conditions are applied to different dielectric layers based on their specific requirements. The first dielectric layer receives high pressure locally to ensure void-free filling and mechanical stability, while the second dielectric layer receives lower pressure locally to prevent image transfer and maintain surface flatness. This local quality approach optimizes each layer's properties according to its functional needs.

The dielectric structure is segmented into two layers with different pressure application conditions. The first layer is laminated at high pressure to ensure reliability and void-free construction, while the second layer is laminated at lower pressure to avoid generating warpage and image transfer. This segmentation allows the system to achieve reliability without the harmful effects of sustained high pressure.

The first dielectric layer is applied and laminated at high pressure in advance to establish mechanical stability and fill voids. This preliminary action ensures reliability before the second dielectric layer is applied at lower pressure, preventing image transfer and warpage in the final structure. The preliminary high-pressure lamination prepares the base structure for subsequent low-pressure lamination.