Multi-layer Wiring Structure Preventing Undercutting
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Solution Overview
Problem
Conventional multi-layer wiring structures in PCBs suffer from undercutting issues during copper wire formation, leading to increased wire spacing and board size, environmental hazards from chemical solutions, and high production costs due to manual operations and chemical usage.
Innovation Solution
A manufacturing method involving a multi-layer wiring structure with thinner insulating layers and conductive structures, where the conductive structures are formed through stamping or etching, and laminated with insulating layers to reduce thickness and prevent undercutting, using a process that eliminates the need for photoresist application and etching, allowing for precise alignment and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If thicker copper wires are used to endure high currents, then current carrying capacity is improved, but undercutting increases and bias distance becomes greater
Solution Approach 1:
The patent applies preliminary action by pre-forming copper wires with vertical sidewalls through stamping or etching before lamination, eliminating the need for subsequent photoresist and etching processes. This preliminary formation of precise wire structures prevents undercutting that would otherwise occur during high-power thick wire formation, allowing thick wires for high current while maintaining manufacturing precision.
Solution Approach 2:
The patent replaces the chemical etching system with a mechanical stamping or etching system to form copper wires. This substitution eliminates the undercutting phenomenon inherent in chemical wet-etching processes, enabling precise wire formation even for thick high-power wires without the bias distance problem.
2Strength
If substrate thickness is increased to enhance strength of sandwich structure, then structural strength is improved, but device size becomes larger
Solution Approach 1:
The patent applies preliminary action by pre-forming precise wiring patterns through stamping or etching before lamination, eliminating the need for thick substrates to accommodate chemical processing. This allows using thinner substrates while maintaining structural strength, as the wiring structures are already precisely formed and do not require the buffer space that thick substrates provide for chemical etching processes.
Solution Approach 2:
The patent changes the physical state and formation method of wiring structures from chemical deposition to mechanical stamping/etching. This parameter change enables the use of thinner substrates while maintaining wiring integrity and structural strength, as the mechanical formation process creates precise wires without requiring the substrate thickness needed for chemical process control.
3Ease of manufacture
If conventional photoresist application and etching procedures are used to form wires, then wire formation is achieved, but chemical solution usage increases causing environmental harm
Solution Approach 1:
The patent extracts and removes the harmful chemical solution-based photoresist and etching processes from the wire formation sequence. By using mechanical stamping or etching to pre-form copper wires, the invention eliminates the need for photoresist application, exposure, developing, and chemical etching, thereby removing the source of chemical pollution while maintaining wire formation capability.
Solution Approach 2:
The patent replaces the chemical-based wire formation system with a mechanical stamping or etching system. This substitution eliminates the use of harmful chemical solutions entirely, as the mechanical process directly forms copper wires through physical means, achieving wire formation without environmental harm from chemical waste.
4Adaptability or versatility
If manual operation is used for material loading, unloading and arrangement, then flexibility is maintained, but production cost increases and human error occurs
Solution Approach 1:
The patent applies preliminary action by pre-forming copper wires and wiring patterns through mechanical stamping or etching before lamination. This preliminary preparation of precise wire structures eliminates the need for manual photoresist application and etching operations, enabling automated processing while maintaining the flexibility to handle different material configurations.
Solution Approach 2:
The patent implements self-service by using mechanical stamping or etching processes that automatically form precise copper wire patterns without requiring manual intervention for photoresist handling, alignment, or etching monitoring. This automation eliminates human error and increases productivity while the modular nature of the process maintains adaptability for different material loading and unloading configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in compact, high-power electronic units with improved insulating properties and reduced production costs, minimizing environmental impact by reducing chemical usage and enabling precise alignment and fault diagnosis without destructive testing.
Implementation Method 1
the first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure
Data Source
AI summary
A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.