Epoxy Resin Molecular Design for Thermal Interface Materials
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Solution Overview
Problem
Existing epoxy resins used in thermal interface materials (TIMs) face challenges in achieving high thermal conductivity and substrate adhesion, which are crucial for efficient heat dissipation in power semiconductors, while also providing flexibility to accommodate thermal deformation.
Innovation Solution
The development of an epoxy resin represented by a specific general formula, which includes a diol compound and diglycidyl ether compounds, results in a cured product with enhanced thermal conductivity and substrate adhesion, incorporating flexible alkylene chains and aromatic units for improved heat resistance and thermal decomposition resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If usual epoxy resins are used to ensure heat resistance, then thermal conductivity is improved, but flexibility deteriorates
Solution Approach 1:
The invention uses a composite molecular structure combining rigid aromatic rings (for heat resistance) and flexible alkylene chains (for flexibility). The epoxy resin comprises a diol compound with aromatic rings and alkylene chains, creating a composite material at the molecular level that simultaneously achieves high heat resistance and flexibility.
Solution Approach 2:
Different parts of the molecular structure serve different functions: the aromatic rings provide heat resistance in specific regions, while the alkylene chains provide flexibility in other regions. This local differentiation of material properties within the same polymer structure resolves the contradiction between heat resistance and flexibility.
2Adaptability or versatility
If polymer materials with good flexibility are used, then flexibility is improved, but thermal conductivity deteriorates
Solution Approach 1:
The invention creates a composite molecular structure where flexible alkylene chains are combined with thermally conductive aromatic rings. This composite structure at the molecular level allows the material to simultaneously achieve flexibility from the alkylene chains and thermal conductivity from the aromatic rings, resolving the contradiction between these two properties.
Solution Approach 2:
The molecular structure is designed with local regions of flexibility (alkylene chains) and local regions of thermal conductivity (aromatic rings), allowing the material to exhibit both properties simultaneously in different parts of the polymer structure.
3Temperature
If epoxy resin with rigid skeleton is used to achieve heat resistance, then thermal conductivity is improved, but adhesion to substrates deteriorates
Solution Approach 1:
The molecular structure is designed with local rigid aromatic regions for heat resistance and local flexible alkylene chain regions for adhesion. The flexible portions can conform to substrate surfaces and accommodate thermal deformation, maintaining strong adhesion while the aromatic rings provide heat resistance.
Solution Approach 2:
The invention changes the molecular parameters by introducing flexible alkylene chains with specific carbon atom counts (1-20) into the epoxy resin structure. This parameter modification allows the material to maintain heat resistance while gaining improved adhesion and flexibility properties.
Data Source
AI summary
The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.