Position Detection Sensor Terminal Design for Mass Production
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Solution Overview
Problem
Existing position detection sensors with covered lead wires lack terminals, requiring labor-intensive soldering for connection to external circuits, making them unsuitable for mass production and increasing costs, especially for large sensors.
Innovation Solution
A position detection sensor with a terminal formed on the substrate, where covered lead wires are bonded in a predetermined pattern, with exposed ends aligned and connected to terminal conductors, allowing easy electrical connection through the terminal, reducing labor and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If covered lead wires are used to form electrode conductors without terminals, then cost is reduced and wiring is simplified, but connection to external circuits becomes labor-intensive requiring extensive soldering
Solution Approach 1:
The patent divides the sensor structure into distinct functional zones: a terminal region for external connections and a sensor pattern region for detection. The terminal conductors are separated from the covered lead wires, allowing the terminal area to be optimized for connection while the sensor area maintains cost-effective covered lead wire construction.
Solution Approach 2:
The patent introduces terminal conductors as an intermediary element between the covered lead wires and external circuits. These terminal conductors serve as a mediation layer that facilitates easy external connection without requiring soldering of the covered lead wires themselves, thus resolving the contradiction between cost-effective manufacturing and ease of connection.
2Manufacturing precision
If through-holes are formed in the base board and both surfaces are used for electrode conductors, then overlapping of electrode conductors is avoided, but formation cost increases due to additional processing steps
Solution Approach 1:
The patent resolves the overlapping problem by transitioning from a two-dimensional planar arrangement to a three-dimensional stacked arrangement. Multiple electrode conductor patterns are formed on different layers (front surface, back surface, and intermediate layers) of the base board, allowing conductors to cross without overlapping by utilizing the vertical dimension.
Solution Approach 2:
The patent implements a multi-layer nested structure where electrode conductor patterns are embedded within the base board at different depths and orientations. The patterns are nested in such a way that they interleave without overlapping, with conductors on different layers passing through or alongside each other in the vertical dimension.
Data Source
AI summary
A terminal, in which terminal conductors are disposed, is preliminarily formed on one surface of a substrate. Electrode conductors including covered lead wires are disposed in a region on the one surface of the substrate that does not overlap the terminal, the electrode conductors being bonded to the substrate by an adhesive material to form a predetermined conductor pattern, whereby a sensor pattern is disposed on the substrate. The lead wires of the electrode conductors are exposed due to the covering being removed at ends of the covered lead wires, the exposed lead wires are disposed while being aligned with and connectable to the corresponding terminal conductors of the terminal. The terminal conductors of the terminal and respective exposed lead wires of the electrode conductors of the sensor pattern are then electrically connected.