Wiring Substrate Adhesion via Roughened Resin Surface
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Solution Overview
Problem
Existing methods for manufacturing wiring substrates using metal wires on synthetic resin bases often result in insufficient adhesion of the metal wire to the substrate, as the ion catalyst application only modifies the surface without adequate embedding in the resin.
Innovation Solution
A wiring substrate with a resin-based substrate containing an organic substance with a hydroxyl group, where the metal plating layer is formed at a roughened surface area with the organic substance embedded in the resin, enhancing adhesion through chemical bonding with a catalyst, and potentially higher volume density of the organic or metal particles near the surface compared to the center.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ion catalyst is applied to the surface of synthetic resin base body, then metal wire can be formed by electroless plating, but the adhesion of metal wire to base body is insufficient
Solution Approach 1:
The patent applies preliminary action by roughening the substrate surface before catalyst application. The surface is pre-modified to create a rough structure that will enhance adhesion, and then the catalyst is applied to this pre-prepared surface. This sequential approach ensures the surface is optimally prepared for metal wire formation, resolving the adhesion issue without complicating the overall manufacturing process.
Solution Approach 2:
The patent implements local quality by creating a rough surface structure specifically at the metal wire formation portions of the substrate. This localized roughening ensures that adhesion enhancement is concentrated where metal wires will be formed, rather than modifying the entire substrate surface uniformly. This targeted approach improves adhesion where needed while maintaining manufacturing efficiency.
2Reliability
If surface is modified by bringing ion catalyst into contact, then electroless plating can occur, but the metal wire adhesion remains insufficient
Solution Approach 1:
The patent creates a rough surface structure specifically at the metal wire formation portions rather than uniformly across the entire substrate. This localized roughening ensures adhesion enhancement is concentrated where metal wires will be formed, providing precise control over where adhesion improvement occurs without requiring uniform modification of the entire surface.
3Reliability
If organic substance with hydroxyl group is embedded in resin at roughened surface, then adhesion is enhanced, but manufacturing process becomes more complex
Solution Approach 1:
The patent creates a composite structure by embedding organic substances with hydroxyl groups into the roughened surface regions of the substrate. This composite approach combines the substrate material with organic substances that provide chemical bonding capabilities, enhancing adhesion through the hydroxyl groups that can form bonds with the metal wire while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced adhesion of the metal wire to the substrate is achieved by forming the metal plating layer at a roughened surface area with embedded organic or metal particles, increasing the bonding strength and stability of the metal wire on the substrate.
Implementation Method 1
an organic substance having a hydroxyl group... in a state of being embedded in the resin, and a catalyst
Implementation Method 2
irradiating a base body made of a synthetic resin and serving as a substrate with a laser beam to modify its surface
Data Source
AI summary
A wiring substrate at which a metal wire is formed includes a substrate containing a resin as a main component and an organic substance having a hydroxyl group; and a metal plating layer constituting the metal wire. A formation portion of the metal wire at one surface of the substrate is rougher than a non-formation portion of the metal wire at the one surface of the substrate, and has the organic substance in a state of being embedded in the resin, and a catalyst. The wiring substrate with such a configuration can increase the adhesion of the metal wire to the substrate.