PCB Bonding Pad and Contact Pad Integration for ESD Protection
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Solution Overview
Problem
Current printed circuit board (PCB) designs face inefficiencies in fanout design due to manual processes, leading to reduced design efficiency and increased costs, and are vulnerable to Electro-Static discharge (ESD) damage, which affects product yield.
Innovation Solution
A PCB connection structure integrating bonding pad areas, dummy pad areas connected to ground, and a contact pad area between them, with MOS switches and Schottky diodes to manage ESD, eliminating the need for additional contact pads and optimizing area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a separate contact pad area is arranged in addition to bonding pad areas, then electrical connection to external input connector is achieved, but PCB area is increased and product cost is raised
Solution Approach 1:
The patent merges the contact pad area with the bonding pad area by positioning the contact pad within the bonding pad region. The contact pad is electrically connected to the bonding pad through a conductive structure, allowing the same physical space to serve both as a contact point for external connectors and as a bonding area for the display module, thereby eliminating the need for separate dedicated contact pad areas.
Solution Approach 2:
The bonding pad area is designed to serve multiple functions: it acts as both a bonding interface for the display module and as a contact area for external input connectors. This multi-functional design allows the PCB to achieve electrical connection capabilities without requiring additional dedicated space for contact pads, thus reducing overall PCB area while maintaining full functionality.
2Adaptability or versatility
If fanout design is completed manually by PCB engineers, then design flexibility is maintained, but design efficiency is reduced and time is increased
Solution Approach 1:
The patent implements a fanout design sharing mechanism that allows successful fanout designs to be saved as templates and reused across different PCB projects. When a new PCB design is needed, engineers can copy existing fanout designs and modify them as required, rather than creating fanout designs from scratch each time. This significantly improves design efficiency while maintaining the flexibility to adapt to different requirements.
3Area of stationary object
If contact pad area is integrated into bonding pad area, then PCB area is reduced and cost is lowered, but ESD protection capability may be compromised
Solution Approach 1:
The patent introduces a conductive structure (such as a via or trace) as an intermediary element that electrically connects the contact pad to the bonding pad. This conductive pathway allows the integrated structure to maintain both area efficiency and ESD protection capability by providing a controlled electrical connection that can incorporate protection mechanisms while sharing the same physical space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances design efficiency by reducing PCB area requirements, lowering costs, and effectively preventing ESD damage, thereby improving product yield and automation in manufacturing.
Implementation Method 1
arrangement of diodes and switches (MOS), which can prevent the Electro-Static discharge (ESD) in the fanout area from damaging an assembly on the printed circuit board (PCB)
Data Source
AI summary
This application relates to a printed circuit board, including: a plurality of bonding pad areas configured to be electrically connected to a display; a plurality of dummy pad areas located in the plurality of bonding pad areas and configured to be connected to the ground; and a contact pad area existing between the plurality of dummy pad areas and electrically connected to the bonding pad area. The contact pad area includes a plurality of contact pads configured to be electrically connected to an external input connector. A width of the plurality of contact pads is 0.3 mm, and a distance between the plurality of contact pads is 0.2 mm. A length of the contact pad is the same as a length of a bonding pad in the bonding pad area.