Planar Electronic Device With Substrate Vent Opening
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Solution Overview
Problem
Trapped air, moisture, and other fluids within the recess of planar electronic devices can expand or corrode magnetic components, leading to damage and degradation of the device's operation during fabrication and environmental changes.
Innovation Solution
Incorporating vent openings within the substrate that connect the recess to the atmosphere, allowing trapped fluids to escape and preventing damage by providing a pathway for air and moisture to vent out.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the recess is sealed to hold the magnetic body, then the magnetic component is securely contained, but air and moisture become trapped causing expansion and corrosion damage
Solution Approach 1:
The recess structure is segmented into a sealed portion for containing the magnetic body and an open portion that communicates with the exterior through a vent opening. This segmentation allows the recess to simultaneously provide secure containment while enabling fluid escape paths, resolving the contradiction between sealing and venting requirements.
Solution Approach 2:
The vent opening acts as an intermediary element between the sealed recess environment and the external atmosphere. It provides a controlled interface that allows air and moisture to escape while maintaining the structural integrity of the recess, thereby preventing harmful accumulation without compromising containment.
2Ease of manufacture
If the recess is sealed during fabrication, then component placement is simplified, but trapped fluids cause damage during subsequent heating and environmental changes
Solution Approach 1:
The vent opening is formed as part of the recess structure before the magnetic body is placed. This preliminary action ensures that the escape path for air and moisture is already in place during component placement and subsequent fabrication processes, preventing damage during solder reflow and other heating operations while maintaining ease of manufacture.
Solution Approach 2:
The vent opening provides beforehand cushioning by pre-establishing an escape route for expanding air and moisture. This prevents sudden pressure buildup and potential damage during subsequent fabrication steps, cushioning the system against thermal and environmental stresses before they occur.
3Reliability
If a vent opening is added to allow fluid escape, then air expansion and moisture corrosion are prevented, but the substrate structure becomes more complex
Solution Approach 1:
The vent opening is merged with the recess structure, forming an integrated feature rather than a separate component. The recess and vent opening are created as a unified structure in the substrate, reducing overall device complexity while maintaining the protective function of allowing fluid escape.
Solution Approach 2:
The recess structure serves multiple functions: it contains the magnetic body, provides a pathway for vent openings, and protects against fluid damage. This multi-functionality reduces the need for additional separate structures, thereby minimizing device complexity while achieving reliable protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents damage from air expansion and corrosion, enhancing the reliability and cost-effectiveness of the fabrication process by reducing the risk of component failure and simplifying the manufacturing steps.
Implementation Method 1
The vent opening provides a pathway for fluid to flow from the recess to the atmosphere
Implementation Method 2
trapped air may expand within the recess when subjected to elevated temperatures during a subsequent fabrication step
Implementation Method 3
moisture and/or other fluids that remain trapped within the recess that holds the magnetic body may corrode the magnetic body
Data Source
AI summary
A planar electronic device includes a dielectric substrate having a recess. A functional electrical component is disposed within the recess of the substrate. A vent opening extends within the substrate such that the vent opening intersects the recess within a thickness of the substrate. The vent opening is open to atmosphere such that the vent opening fluidly connects the recess to the atmosphere.


