Carrier-Attached Ultra-Thin Copper Foil for Stable Thermal Peeling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of maintaining stable peeling strength between carrier foils and ultra-thin copper foils during long-term high-temperature processes in the production of multilayer printed circuit boards, particularly in coreless constructions, is not adequately addressed by conventional peelable carrier copper foils, leading to increased peeling strength issues.
Innovation Solution
A manufacturing method involving surface functionalization with an amine-based polymer compound to form a modification layer, followed by activation with a palladium catalyst to create an activation layer, and subsequent formation of an ultra-thin copper foil, allowing the polymer substrate to be easily separated from the copper foil via these layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional peelable carrier copper foils are used, then the copper foil can be easily peeled from the substrate, but the peeling strength significantly increases during long-term high-temperature processes
Solution Approach 1:
The invention divides the interface between carrier and copper foil into multiple functional layers: a release layer containing fluorinated compounds and a surface treatment layer. This segmentation allows each layer to perform its specific function - the release layer provides easy peeling while the surface treatment layer maintains stability during thermal processes, resolving the contradiction between peeling ease and thermal stability.
Solution Approach 2:
The invention changes the chemical parameters of the interface layers by introducing fluorinated compounds with specific molecular structures and performing surface treatments that create stable chemical bonds. These parameter changes enable the release layer to maintain low peeling strength even after long-term exposure to high temperatures, addressing the stability issue while preserving ease of operation.
2Length of moving object
If the copper foil thickness is reduced to meet miniaturization requirements, then the device size is reduced, but the peeling strength becomes unstable during thermal processes
Solution Approach 1:
The invention uses composite material structures at the interface, combining the release layer with fluorinated compounds and the surface treatment layer. This composite structure provides enhanced chemical stability and bond strength that compensates for the reduced copper foil thickness, ensuring reliable peeling strength maintenance during thermal processes even with ultra-thin copper foils.
Solution Approach 2:
The surface treatment layer acts as an intermediary between the release layer and the ultra-thin copper foil, providing stable chemical bonding that ensures peeling strength reliability. This intermediary layer is crucial for maintaining bond stability during thermal processes when working with thin copper foils that have lower inherent mechanical strength.
3Adaptability or versatility
If multiple laminations are performed for multilayer PCBs, then the circuit board functionality is enhanced, but the peeling strength between carrier and copper foil significantly increases
Solution Approach 1:
The invention applies preliminary surface treatment to the release layer before copper foil deposition, creating a stable chemical structure that resists peeling strength increase during subsequent multiple lamination processes. This preliminary action ensures that even after multiple high-temperature laminations, the peeling strength remains within the optimal range for easy carrier removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures stable peeling strength and enhanced release properties, enabling the carrier-attached ultra-thin copper foil to withstand high-temperature processes while maintaining optimal peeling characteristics, suitable for multilayer printed circuit boards.
Implementation Method 1
a surface functionalization step includes using an amine-based polymer compound to modify a polymer substrate, so as to form a modification layer on at least one surface of the polymer substrate
Implementation Method 2
a surface activation step includes using a palladium catalyst to activate the modification layer, so as to form an activation layer on a surface of the modification layer away from the polymer substrate
Data Source
AI summary
A carrier-attached ultra-thin copper foil and a method for manufacturing the same are provided. The method includes modifying a polymer substrate with an amine-based polymer compound to form a modification layer on at least one surface of the polymer substrate. A palladium catalyst is then used to activate the modification layer, thereby forming an activation layer on the modification layer. Subsequently, an ultra-thin copper foil is formed on the activation layer, in which the polymer substrate can be separated from the ultra-thin copper foil via the modification layer and the activation layer.