Insulating Substrate Metal Adhesion Improvement TRIZ Cases

A copper-rich cover layer over a silver-containing base metal improves ceramic bonding while suppressing silver migration and short-circuit risk.

A smooth adhesive film with protrusions improves printed wiring board bonding, reducing peeling, cracking, and signal noise in larger multilayer builds.

A non-uniform alloy seed layer strengthens resin-to-conductor adhesion in vias, reducing thermal-stress breakage and preserving signal stability.

Patterned roughness nodules form defined channels in copper foil, improving conduction paths and reducing channel loss in circuitry.

A dual-layer resin and silane-treated filler film improves PCB plating adhesion while keeping surface roughness, dielectric loss, and thermal expansion low.

A stepped insulating layer and locally thicker edge adhesive improve multilayer bonding and block water and oxygen ingress near through-holes.

A Zn-transition metal interlayer helps copper foil bond to low-loss fluororesin while retaining strong adhesion at high temperatures.

Ti-Ag deposition layers and hot pressing strengthen ceramic-to-metal PCB bonding while reducing peeling risk and manufacturing cost.

Adhesive-free lamination of stacked circuit board units improves flatness and electrical characteristics while cutting process time and cost.

A conductor component wicks between filler and resin to strengthen wiring board adhesion while keeping the insulating surface smooth and thin.

Segmented conductive blocks joined by adhesive bodies and spanning conductive layers resist thermal expansion and prevent substrate component failure.

A stepped conductor profile and silane-coated tin layer increase resin adhesion in fine wiring boards while limiting migration and shorts.

Clustered Zn particles over a Cu particle layer preserve PCB adhesion at high temperature while avoiding higher transmission loss and slower etching.

A nickel-copper alloy interlayer cuts insertion loss in flexible copper clad laminates while preserving peel strength for 1-4 GHz signals.

Nitrogen on a fluororesin PCB substrate helps discharge fluorine compounds during wet etching, limiting conductive-layer corrosion and wire adhesion loss.