Multilayer Circuit Board Lamination Without Adhesive Layers
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Solution Overview
Problem
Conventional multilayer circuit boards face issues with unsatisfactory electrical characteristics, high manufacturing costs, and manufacturing inefficiencies due to the use of adhesive layers, as well as problems with surface flatness and misalignment between layers.
Innovation Solution
A circuit board design that alternately laminates insulating base materials without adhesive layers, using trapezoidally shaped metal layers to connect through holes with conductive paste, and employs a manufacturing process that etches metal layers to form patterned shapes, reducing the need for adhesives and shortening the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an adhesive layer is used to bond substrates in multilayer printed wiring boards, then the substrates can be bonded together, but the electrical characteristics are not satisfactory and manufacturing cost increases
Solution Approach 1:
The invention extracts and removes the adhesive layer from the multilayer circuit board structure. By eliminating the adhesive layer entirely and directly bonding insulating base materials with metal layers, the patent achieves both improved electrical characteristics and reduced manufacturing cost, resolving the technical contradiction between reliability and ease of manufacture.
Solution Approach 2:
The invention introduces a metal layer as an intermediary bonding interface between insulating base materials. This metal layer serves as both the electrical conductor and the bonding medium, replacing the adhesive layer's bonding function while providing superior electrical characteristics, thus resolving the contradiction between reliability and manufacturing cost.
2Stability of the object's composition
If multiple substrates are bonded using an adhesive layer, then lamination is achieved, but substantial wastage occurs in terms of cost
Solution Approach 1:
The invention extracts the adhesive layer from the lamination process. By removing this unnecessary material that causes cost wastage, the patent achieves lamination through direct bonding of insulating base materials via metal layers, maintaining structural stability while eliminating substance loss and associated costs.
3Shape
If a build-up multilayer wiring board is manufactured, then a multilayer structure is achieved, but the manufacturing process requires a very long time
Solution Approach 1:
The invention segments the manufacturing process into independent unit components, each consisting of an insulating base material with metal layers formed on both surfaces. These unit components are manufactured separately and then rapidly assembled by stacking and bonding, significantly reducing the overall manufacturing time while maintaining the multilayer structure.
Solution Approach 2:
The invention performs preliminary actions by pre-forming metal layers on both surfaces of insulating base materials before assembly. This allows unit components to be prepared in advance with all necessary conductive structures, enabling rapid final assembly and reducing total manufacturing process time while achieving the required multilayer configuration.
4Shape
If insulating base material is laminated on a metal layer, then multilayer structure is formed, but flatness of the surface varies causing misalignment and voids
Solution Approach 1:
The invention introduces a resin layer as an intermediary between the metal layer and the subsequently laminated insulating base material. This resin layer acts as a cushioning medium that compensates for surface irregularities, ensuring uniform contact and flatness during lamination, thereby preventing misalignment and void formation while maintaining the multilayer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves electrical characteristics, reduces manufacturing costs, and prevents misalignment and voids, while ensuring uniform flatness and reducing the risk of delamination.
Implementation Method 1
a first conductive paste being filled into a through hole of the first insulating base material so as to connect the first metal layer and the second metal layer
Implementation Method 2
a manufacturing process that etches metal layers to form patterned shapes
Data Source
AI summary
The present invention addresses the problem of providing a circuit board for which the manufacturing process is short and which has a laminate surface having uniform flatness. As a solution to the problem, this method for manufacturing a circuit board includes: manufacturing a three-layer metal (58) having, on one surface thereof, a first metal layer (26) formed in a pattern shape; manufacturing unit structures (60) each having the first metal layer (26), a cured first insulating base material (22) filled with a cured first conductive paste (32), a second metal layer (28), and a semi-cured second insulating base material (24) filled with a semi-cured second conductive paste (36); joining together the first insulating base material (22) in one unit structure (60) among a plurality of the unit structures with the second insulating base material (24) in another unit structure (60); and layering the plurality of unit structures (60).