Patterned Copper Foil Channels for Lower Signal Loss

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Solution Overview

Problem

Existing copper foils used in information handling systems lack efficient conduction paths, leading to increased channel loss and reduced electrical conductivity.

Innovation Solution

Copper foil with a flexible conductive surface featuring multiple rows of roughness nodules arranged in predetermined patterns, with channels formed between pairs of these nodules to enhance conduction paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional smooth copper foil is used, then manufacturing is simple, but electrical conductivity is insufficient and channel loss increases

Engineering Contradiction:

Improveelectrical conductivityVSAvoidsurface structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The copper foil surface is modified with roughness nodules arranged in specific patterns, creating localized variations in surface topology. These nodules are distributed non-uniformly across the surface, with higher density in regions requiring enhanced conduction paths, thereby improving electrical conductivity where needed without complicating the entire structure

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The continuous copper foil surface is segmented into distinct regions by introducing patterned roughness nodules. These nodules create discrete conduction paths separated by insulating regions, effectively segmenting the conductive flow into controlled channels that reduce interference and improve signal integrity

Inventive Principle:

Principle #1Segmentation

2Reliability

If patterned roughness nodules are added to enhance conduction paths, then electrical conductivity improves, but manufacturing complexity increases

Engineering Contradiction:

Improveconduction path efficiencyVSAvoidfoil production complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The roughness nodules are formed on the copper foil surface during the manufacturing process itself, rather than as a post-processing step. This preliminary formation integrates the patterned structure into the base material creation, avoiding additional complex manufacturing stages

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The manufacturing process utilizes controlled variations in deposition parameters to create the roughness nodules. By adjusting electrochemical deposition conditions such as current density, temperature, and electrolyte composition, the nodule patterns are formed through parameter changes rather than mechanical or chemical post-treatment

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20260025909A1Copper foil having patterned roughness nodules

Publication Date: 2026.01.22 DELL PROD LP

AI summary

Copper foil to provide electrical conductivity includes a flexible conductive surface on which multiple roughness nodules are formed, arranged according to a predetermined pattern. One or more channels extend between a pair of rows of the roughness nodules, each channel provides a conduction path.