Wiring Board Interface Structure for Adhesion Without Surface Roughness
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Solution Overview
Problem
Existing wiring boards face issues with conductor circuits peeling off due to large surface roughness of insulating layers, reduced contact area leading to high transmission loss, and increased thickness, which are exacerbated by high-definition pattern formation and multilayer board requirements.
Innovation Solution
A structure body with an insulator and conductor layer where the conductor layer component enters between fillers and resin, forming a thin film that enhances adhesiveness while reducing surface roughness, using a curable composition containing specific resins and fillers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the surface of the insulating layer is roughened to improve adhesiveness between the conductor layer and insulator, then adhesiveness is improved, but surface roughness increases causing conductor circuit peeling and increased transmission loss
Solution Approach 1:
The invention segments the insulating layer into multiple functional zones: a first insulating layer with controlled surface roughness for low transmission loss, and a second insulating layer with roughened surface for high adhesiveness. This segmentation allows each layer to optimize for its specific function without compromise
Solution Approach 2:
Different surface roughness characteristics are applied to different regions/layers of the insulating structure. The first insulating layer maintains smooth surface quality where signal transmission occurs, while the second insulating layer provides roughened surfaces specifically at conductor contact points for enhanced bonding
2Length of stationary object
If the insulating layer is thinned to reduce board thickness and weight, then thickness is reduced, but electric insulation and mechanical strength deteriorate
Solution Approach 1:
The invention uses a composite structure of two different insulating layers with distinct properties. The first layer provides low dielectric constant for signal transmission, while the second layer provides mechanical support and insulation, achieving thinness without sacrificing reliability
Solution Approach 2:
The invention changes the physical and electrical parameters of the insulating layers by selecting materials with different dielectric constants and mechanical properties, allowing optimization of both thickness and insulation performance simultaneously
3Manufacturing precision
If high-definition pattern formation is implemented to increase circuit density, then circuit density is improved, but contact area between conductor and insulator decreases leading to higher transmission loss
Solution Approach 1:
The invention addresses the reduced contact area in high-definition patterns by extending the bonding interface into the vertical dimension through the layered insulating structure, compensating for the limited horizontal contact area with enhanced vertical adhesion and reduced transmission loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent adhesiveness between the insulator and conductor layer, reduces surface roughness, and enables thinner, higher-definition conductor circuits with improved electrical insulation.
Implementation Method 1
a conductor layer component identical to at least one component constituting the conductor layer enters between some of the fillers and the resin from an interface between the insulator and the conductor layer
Data Source
AI summary
A structure body, including: an insulator, and a conductor layer provided on a surface of at least a portion of the insulator, where: the insulator includes a resin and a filler, and at least one conductor layer component of the conductor layer is present between at least one of the filler and the resin from an interface between the insulator and the conductor layer, and is connected to the conductor layer.