Circuit Substrate Assembly Structure for Thermal Expansion Resistance
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Solution Overview
Problem
Existing circuit substrate assemblies are prone to thermal expansion, leading to internal components falling off or breaking due to heat or external stress.
Innovation Solution
A circuit substrate assembly design incorporating conductive blocks connected by adhesive bodies with conductive layers, enhancing structural strength through symmetrical or asymmetrical arrangements of adhesive and conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional circuit substrate assembly is used, then manufacturing simplicity is maintained, but structural strength deteriorates under thermal expansion
Solution Approach 1:
The circuit substrate is divided into multiple conductive blocks (first conductive block, second conductive block, etc.) separated by channels. Each conductive block is independently connected through adhesive bodies, allowing differential thermal expansion while maintaining overall structural integrity. This segmentation prevents stress concentration and component failure under thermal loading.
Solution Approach 2:
The patent employs composite material structures combining conductive blocks, adhesive bodies, and conductive layers. The adhesive bodies fill channels between conductive blocks with different materials having complementary properties - some materials provide thermal expansion compensation while others provide mechanical strength. This composite approach resolves the contradiction between structural strength and thermal expansion resistance.
2Reliability
If conventional circuit substrate assembly is used, then manufacturing simplicity is maintained, but component reliability deteriorates under heat stress
Solution Approach 1:
The adhesive bodies are pre-filled with conductive materials and insulating materials in specific patterns before assembly. The conductive layers are pre-positioned to span across conductive blocks in advance. This preliminary preparation ensures that when thermal stress occurs during operation, the stress distribution is already optimized to prevent component failure, thereby improving reliability without requiring complex active control mechanisms.
Solution Approach 2:
The adhesive bodies serve as intermediary elements between conductive blocks, providing both mechanical bonding and thermal stress management. These intermediary structures absorb and distribute thermal expansion forces, preventing direct transmission of stress to sensitive components. The conductive layers acting as intermediaries ensure electrical connectivity while accommodating dimensional changes, thus maintaining component reliability under heat stress.
3Strength
If conductive blocks are connected with adhesive bodies, then structural strength is improved, but manufacturing complexity increases
Solution Approach 1:
The adhesive bodies and conductive layers are merged into an integrated assembly process. Multiple adhesive bodies are positioned and filled with conductive materials in a single manufacturing step, followed by the attachment of conductive layers that span across all conductive blocks simultaneously. This merging of operations reduces the number of separate manufacturing steps compared to individual bonding operations, thereby improving ease of manufacture while maintaining structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves structural integrity, preventing component failure from heat or external stress, ensuring durability and reliability.
Implementation Method 1
The first connecting adhesive body is filled in the first channel to connect the first conductive block and the second conductive block
Implementation Method 2
The at least one first conductive layer is attached to the first surface of the first connecting adhesive body and spans the first conductive block and the second conductive block
Data Source
AI summary
A circuit substrate assembly and a power module are provided. The circuit substrate assembly includes a first conductive block, a second conductive block, a first connecting adhesive body, and at least one first conductive layer. The first conductive block has a first top surface and a first bottom surface opposite to each other. The second conductive block has a second top surface and a second bottom surface opposite to each other. A first channel is formed between the second conductive block and the first conductive block. The first connecting adhesive body is filled in the first channel to connect the first conductive block and the second conductive block. The at least one first conductive layer is attached to the first surface of the first connecting adhesive body and spans the first conductive block and the second conductive block that are isolated by the first connecting adhesive body.