Through-Hole Layer Structure for Edge Adhesion and Moisture Blocking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic devices face issues with poor adhesion of multilayer structures and water/oxygen infiltration in the edge areas or around through-holes, affecting their reliability.
Innovation Solution
An insulating layer structure with a second insulating layer filling recesses in the first insulating layer, an adhesive layer with greater thickness than the second insulating layer, and a functional layer, providing a uniform bonding surface to enhance adhesion and prevent moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive layer thickness is increased to improve adhesion, then the bonding strength between layers is improved, but the device complexity and material usage increase
Solution Approach 1:
The adhesive layer is designed with non-uniform thickness, being thicker at the edge area where adhesion is most critical and thinner toward the center. This local variation in thickness optimizes bonding strength where needed without unnecessarily increasing complexity or material usage throughout the entire structure.
Solution Approach 2:
The insulating layer is divided into a first insulating layer and a second insulating layer, with the second layer filling recesses in the first layer. This segmentation creates a more uniform bonding surface for the adhesive layer, improving adhesion without requiring a uniformly thick adhesive layer throughout, thus reducing overall complexity.
2Reliability
If the adhesive layer thickness is increased to prevent peeling, then the bonding reliability is improved, but the amount of adhesive material increases
Solution Approach 1:
The adhesive layer thickness is locally increased only at the edge area where peeling is most likely to occur, rather than uniformly throughout. This targeted approach improves bonding reliability at the critical edge regions while minimizing the total quantity of adhesive material used.
Solution Approach 2:
The second insulating layer fills recesses in the first insulating layer before the adhesive layer is applied. This preliminary action creates a uniform bonding surface that prevents peeling by ensuring proper adhesion geometry, thereby reducing the need for excessive adhesive material quantities.
3Object-affected harmful factors
If the insulating layer structure is modified to prevent water and oxygen infiltration, then the protection against moisture is improved, but the manufacturing complexity increases
Solution Approach 1:
The insulating layer is segmented into two distinct layers: a first insulating layer and a second insulating layer that fills recesses in the first layer. This segmentation creates a more uniform surface that effectively prevents water and oxygen infiltration paths, improving protection without requiring overly complex single-layer structures.
Solution Approach 2:
The second insulating layer is nested within the recesses of the first insulating layer, creating a stepped or recessed structure. This nested configuration fills gaps and creates a more uniform surface profile that blocks moisture and oxygen infiltration while maintaining a relatively simple overall structure that can be manufactured using standard processes.
Data Source
AI summary
An electronic device is provided. The electronic device includes an insulating layer, an organic layer, an adhesive layer, and a functional layer. The insulating layer has a through hole and a side surface adjacent to the through hole. The organic layer is disposed on the insulating layer. The adhesive layer is disposed on the organic layer. The functional layer is disposed on the adhesive layer. In a cross-sectional view of the electronic device, at the side surface of the insulating layer, a first thickness of the adhesive layer is greater than a first thickness of the organic layer.