Component Carrier Embedded High-Frequency Component Waveguide
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Solution Overview
Problem
High-frequency signal transmission on component carriers, such as printed circuit boards, faces challenges due to increasing miniaturization and the need for robust mechanical and electrical reliability, while also managing heat dissipation and signal quality degradation from passive intermodulation and long signal paths.
Innovation Solution
A component carrier is designed with a laminated stack incorporating electrically conductive and insulating layers, embedded high-frequency components, integrated waveguides, transmission lines, and coupling elements for efficient signal transmission and reception, enabling compact and reliable high-frequency operations with reduced signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-frequency components are mounted on conventional printed circuit boards, then high-frequency functionality is achieved, but signal quality deteriorates due to long signal paths and passive intermodulation
Solution Approach 1:
The patent combines the high-frequency component, waveguide, and transmission line into a single integrated component carrier structure. The component is embedded within the carrier, and the waveguide is formed as an integrated structure, merging previously separate elements into one unified device that reduces signal path length and eliminates passive intermodulation from multiple components.
Solution Approach 2:
The patent transitions from conventional planar PCB layouts to a three-dimensional integrated structure where the high-frequency component is embedded within the component carrier and the waveguide extends through multiple layers. This dimensional change allows for shorter signal paths by utilizing vertical and lateral space more efficiently.
2Area of stationary object
If component carriers are miniaturized to accommodate more electronic components, then space efficiency improves, but heat dissipation becomes increasingly difficult
Solution Approach 1:
The patent incorporates a cooling channel structure within the component carrier that allows coolant to flow through designated pathways. This hydraulic cooling system efficiently removes heat from the high-frequency component and other electronic components, enabling miniaturization while maintaining effective thermal management.
3Ease of manufacture
If conventional high-frequency devices are designed with surface mounted components, then ease of manufacture is maintained, but space consumption increases
Solution Approach 1:
The patent embeds the high-frequency component within the component carrier structure, nesting the component inside the carrier rather than mounting it on the surface. The waveguide and transmission line are also integrated within the carrier's internal structure, creating a nested arrangement that significantly reduces the overall device volume while maintaining manufacturability through standardized embedding processes.
Data Source
AI summary
A component carrier which includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a high-frequency component embedded in the stack. At least one waveguide is integrated in the stack. A transmission line and a coupling element configured transmit a signal between the high-frequency component and the at least one waveguide. A transmission and/or reception unit wirelessly transmits and/or receives one or more signals.