Carrier-Free Semiconductor Package RF Microstrip Integration
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Solution Overview
Problem
Existing carrier-free semiconductor packages are difficult to apply in the RF field due to the need for a ground design and a dielectric layer between RF traces and the ground, which increases complexity and thickness.
Innovation Solution
A carrier-free semiconductor package with a circuit structure featuring an insulating layer, conductive and RF traces, and a ground layer, where the ground layer is formed on the opposite surface of the insulating layer with openings to expose the conductive traces, and solder balls connect the ground layer, allowing for a microstrip line with RF function.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ground layer and dielectric layer are added to enable RF functionality, then RF performance is improved, but package thickness and structural complexity increase
Solution Approach 1:
The patent merges the ground layer and RF trace layer into a single substrate structure, where the ground layer is formed on the same substrate as the RF traces. This integration eliminates the need for separate dielectric layers and ground structures, achieving RF functionality while maintaining thin package thickness.
Solution Approach 2:
The patent utilizes the substrate surface area in the planar dimension to accommodate both RF traces and ground layers simultaneously. By arranging ground layers and RF traces in different planar regions on the same substrate thickness level, the design achieves RF functionality without increasing package thickness.
2Reliability
If a ground layer and dielectric layer are added to enable RF functionality, then RF performance is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions (RF signal transmission and ground reference) into a single integrated substrate structure. The substrate simultaneously supports RF traces, ground layers, and encapsulation, eliminating the need for multiple separate components and reducing overall structural complexity.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, carries RF traces, supports ground layers, and serves as the base for encapsulation. This multi-functionality reduces the number of separate components needed, simplifying the overall device structure while enabling RF functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a single-layer carrier-free semiconductor package with low cost and simplified RF functionality, addressing the challenges of thickness and complexity in RF applications.
Implementation Method 1
by using the carrier 10 as a current conductive path for electroplating, conductive traces 12 are formed on the portions of the carrier 10 in the openings 110 of the resist layer 11
Implementation Method 2
an encapsulant formed on the first surface of the insulating layer to cover the circuit layer and the chip
Data Source
AI summary
A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design.