Component Carrier Mounting Protrusions for Reliable Interconnection
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Solution Overview
Problem
Conventional methods for mounting components on component carriers face challenges regarding stability, reliability, and efficient electrical interconnection, especially with the increasing miniaturization and complexity of electronic components.
Innovation Solution
A component carrier with a multi-layer stack comprising electrically conductive and insulating layers, featuring a mounting region with protrusions that insert into corresponding recesses on the component, ensuring stable mechanical and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mounting methods (soldering or adhesive bonding) are used to attach components to component carriers, then electrical interconnection is achieved, but mechanical stability and reliability are insufficient under harsh conditions
Solution Approach 1:
The patent combines multiple functions into the mounting protrusion structure: mechanical support, electrical conduction, and thermal management. The protrusion integrates the mechanical fastening function with embedded conductive pathways, eliminating the need for separate solder joints or adhesive layers while providing robust electrical and thermal connections simultaneously.
Solution Approach 2:
The mounting protrusion is formed as a composite structure combining conductive material (for electrical connection) with structurally robust material (for mechanical strength). This composite approach allows the single protrusion element to simultaneously provide both electrical conductivity and mechanical support, resolving the contradiction between electrical interconnection and mechanical strength.
2Productivity
If electronic components are miniaturized with smaller spacing between contacts, then product functionality increases, but heat dissipation becomes increasingly difficult
Solution Approach 1:
The mounting protrusion acts as an intermediary thermal management structure between the miniaturized electronic components and the component carrier. It provides dedicated thermal conduction pathways that intercept heat at the component level and efficiently transfer it to the carrier, preventing heat accumulation despite increased component density and smaller contact spacing.
3Productivity
If array-like components with multiple contacts and smaller spacing are employed, then product functionality increases, but protection against electromagnetic interference becomes increasingly challenging
Solution Approach 1:
The mounting protrusion structure implements a nested shielding approach where conductive elements are positioned within and around the component mounting area. This nested configuration creates electromagnetic shielding zones that protect sensitive miniaturized components from external interference while maintaining the high component density and functionality required by modern electronic products.
Data Source
AI summary
A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure and a mounting region arranged at the stack. The mounting region configured for mounting a component thereon and having at least one mounting protrusion for insertion of the component in at least one mounting recess.