Component Carrier Protection Layer Removal via Pressurized Fluid
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Solution Overview
Problem
The challenge in manufacturing component carriers, such as printed circuit boards, lies in efficiently and reliably processing only specific portions while ensuring mechanical robustness, electrical reliability, and protection against heat and electromagnetic interference, as conventional methods like manual removal or chemical stripping are costly, labor-intensive, and can damage the surface or leave residues.
Innovation Solution
A method involving the application of a chemically inert and heat-resistant protection layer on select portions of the component carrier, which is then removed using a pressurized fluid jet, such as a water jet, to enable residue-free processing without chemical or thermal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual removal of protection layer is used, then cost and labor intensity are reduced, but productivity is low and it is not suitable for mass production
Solution Approach 1:
The patent replaces manual mechanical removal (tweezers) with automated mechanical systems (robotic arms, automated peeling devices) that can remove protection layers rapidly and consistently. This substitution maintains the gentleness of mechanical removal while dramatically increasing productivity for mass production environments.
Solution Approach 2:
The patent employs pneumatic or hydraulic systems to deliver controlled bursts of air or fluid that facilitate the removal of protection layers. This approach enables automated, high-speed removal without direct mechanical contact, thereby maintaining ease of manufacture while achieving high productivity suitable for mass production.
2Productivity
If aggressive chemicals are used to remove protection layer, then productivity increases and automation becomes possible, but the component carrier surface is harmed
Solution Approach 1:
The patent employs a disposable protection layer made of materials that can be easily removed without leaving residues or damaging the underlying surface. This disposable approach enables automated high-speed removal processes while protecting the component carrier surface, as the protection layer is designed to be sacrificed during removal rather than requiring gentle handling.
Solution Approach 2:
The patent changes the physical or chemical parameters of the protection layer materials to enable easy removal by non-aggressive means. By selecting materials with specific properties (such as water-soluble polymers or heat-release films), the protection layer can be removed rapidly through automated processes using water or heat, achieving high productivity without surface damage.
3Adaptability or versatility
If conventional varnishes are used for selective coverage, then specific portions can be protected, but the varnishes are expensive and only suitable for very specific applications
Solution Approach 1:
The patent employs protection layer materials and application methods that are universally applicable across different component carrier types and processing scenarios. Instead of specialized varnishes for specific applications, the invention uses general-purpose protective films or coatings that can be applied and removed across various manufacturing processes, reducing cost and increasing versatility.
Solution Approach 2:
The patent uses segmentation techniques to apply protection layers only to specific portions of the component carrier that require protection. By dividing the protection application into targeted zones rather than full-surface coverage, the method achieves selective processing capability while using simpler, less expensive materials and processes compared to conventional specialized varnishes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and reliable selective processing of component carriers, ensuring high-quality surfaces for high-frequency applications by removing the protection layer without damaging the microstructure or leaving residues, thus enabling the use of existing production lines with minimal environmental impact.
Implementation Method 1
removing (in particular in a residue-free manner) the protection layer (at least partially) from the first portion using a pressurized fluid (e.g. a water jet)
Data Source
Figure 1~5
Figure 6a~6b
AI summary
It is described a method of manufacturing a component carrier, the method comprising: i) providing a component carrier (100) with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; ii) forming a protection layer (150) on the component carrier (100), so that a first portion (130) of the surface of the component carrier (100) is covered with the protection layer (150), and a second portion (140) of the surface of the component carrier (100) is not covered with the protection layer (150); iii) performing a component carrier manufacture step with respect to the second portion (140); and afterwards iv) removing the protection layer (150) from the first portion (130) using a pressurized fluid.