Printed Circuit Liquid Treatment TRIZ Cases

Continuous uncoiling, processing, and recoiling with distributed tension control prevents layer distortion and cuts multilayer board manufacturing time.

An RFID-enabled nozzle stores usage cycles and fluid history to prevent mistimed replacement and incompatible fluid deposition.

Multi-stage filtration removes particles and breaks down organics so rinse effluent can be recirculated and nearly all water reused.

Elastic and magnetic clamp linkages keep moving PCB material stable, enabling uniform continuous plating with fewer defects.

Detect PCB ionics with a vacuum-sealed snorkel that extracts fluid for resistance testing and ion chromatography.

Alkaline tetraamminecopper (II) sulfate replaces chloride etching to limit silver or tin resist corrosion while maintaining circuit-board etching rate.

A counter-substrate holds fragile stack constituents together while a sacrificial layer enables clean separation from the carrier substrate.

Lever mechanism amplifies small piezo strokes to dispense viscous fluids while thermal expansion compensation maintains accuracy.

Soluble polymers protect substrate structures from processing stress while allowing easy removal via solvent dissolution.

A pressing member with a base and dual portions applies uniform pressure to circuit board preforms.

Vertical tubular walls redirect splashed liquid downward to prevent mixing in adjacent chambers without increasing apparatus size.

Recessed contact areas on the transport roller minimize substrate deformation and pressure peaks while enabling liquid exchange for improved drying efficiency.

A washing device uses a vertically movable basket rotating around a vertical axis to clean printed circuit boards.

Vertical plate positioning uses gravity to drain sprayed acid, preventing liquid accumulation and ensuring uniform etching quality.

Oblique upward squirting prevents dissolved oxygen increase from bubble generation while reducing processing solution volume.

A pressurized fluid jet removes a chemically inert protection layer from component carrier surfaces without causing mechanical damage or leaving residues.

Selective UV curing reduces energy consumption and manufacturing time while ensuring complete hardening of the critical resin layer beneath the wiring.

An optical measurement system detects spray pattern edges via light beams, eliminating mechanical movement and reducing material waste during conformal coating.

Segmented resin deposition fills weave gaps to eliminate warp-weft dielectric differences, preventing signal time delay in high-speed transmission.

A polymer-free leading board connects raw material rolls to maintain continuous transfer tension during semiconductor processing.

A patterned transparent conductor uses metal nanowire networks to deliver high electrical conductivity and optical transparency on flexible substrates.

Differentiating conductor surface roughness resolves the trade-off between signal transmission stability and solder adhesion reliability.

Amine-based cleaning maintains pH 7 to 13 to remove contaminants while minimizing cap layer thickness loss.

Halogen-based pre-cleaning removes oxides via sublimation while chlorine passivation prevents re-oxidation during high-temperature processing.

High volume flow at low pressure removes etching fluid via a comb-like lance, preventing substrate adhesion and ensuring uniform suction.