Oblique Upward Liquid Squirting for Electroless Plating
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Solution Overview
Problem
Existing electroless plating techniques face issues with complex facility design, excessive processing solution usage, poor plating quality due to dissolved oxygen, and inability to treat both sides of vertically held workpieces, especially for thin items.
Innovation Solution
A surface treating apparatus with a transport hanger for vertical workpiece handling, a tank body for processing solution circulation, and a liquid squirting system that directs the solution obliquely upward in a parabolic path from multiple holes or a long slit, with a redirection member to ensure uniform coverage and minimize solution usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If processing solution is squirted downward to horizontal plane, then work can be treated, but dissolved oxygen increases due to bubble generation and surface treatment quality deteriorates
Solution Approach 1:
The patent inverts the conventional downward squirting direction and sprays the processing solution obliquely upward instead. This reversal prevents bubble generation and dissolved oxygen increase while still achieving uniform coating on the workpiece surface.
Solution Approach 2:
The patent changes the spray parameters by adjusting the spray angle to be oblique and upward-directed rather than downward-horizontal. This parameter modification eliminates the harmful effect of bubble formation while maintaining effective surface treatment.
2Reliability
If rack is dipped into accumulated processing solution, then electroless plating can be performed, but facility becomes more complex and larger
Solution Approach 1:
The patent extracts the workpiece from the accumulated processing solution and instead sprays the solution onto the workpiece surface. This eliminates the need for dip tanks and rise-and-fall mechanisms, simplifying the facility while maintaining electroless plating capability.
Solution Approach 2:
The patent uses a spray system to deliver the processing solution onto the workpiece, replacing the conventional dipping method. This hydraulic approach eliminates complex mechanical dip tanks and enables more compact facility design.
3Manufacturing precision
If processing solution is squirted downward to horizontal plane, then work can be treated, but a mass of processing solution is required
Solution Approach 1:
The patent applies the processing solution locally and directly onto the workpiece surface through oblique upward spraying. This targeted application reduces the total quantity of processing solution required compared to conventional downward squirting methods that require large volumes for coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This setup allows for high-quality electroless plating on vertically held workpieces by reducing dissolved oxygen, minimizing solution usage, and ensuring even coverage, while preventing solution scattering and allowing for efficient processing of both sides of workpieces.
Implementation Method 1
a liquid squirting part for squirting the processing solution from a squirt port toward the treatment object obliquely upward to a horizontal plane
Implementation Method 2
a tank body for attaching processing solution interiorly to the treatment object which is transported by the transport hanger
Data Source
AI summary
An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.