Etching Fluid Suction Device with Comb Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing suction devices for etching processes in wet-chemical etching of substrates, such as printed circuit boards and semiconductor wafers, are inefficient in fluid removal due to reliance on high differential pressure, which can lead to substrate adhesion and uneven fluid suction.
Innovation Solution
A suction device with a high suction volume flow (30-300 m3/h) and low differential pressure (up to 8kPa) utilizing a comb-like suction structure and radial fan or side channel compressor, allowing for effective fluid removal via flow velocity principles, with suction nozzle openings positioned close to transport rollers to optimize fluid collection and reduce substrate adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high differential pressure is used for suction, then suction power is improved, but substrate adhesion occurs and fluid suction uniformity deteriorates
Solution Approach 1:
The invention changes the suction parameters from high differential pressure to high volume flow rate with low differential pressure (≤8kPa). This parameter transformation maintains effective suction power while eliminating substrate adhesion, as the high flow velocity achieves fluid removal without excessive pressure differential that causes adhesion.
Solution Approach 2:
The invention employs a radial fan or side channel compressor to generate high volume flow rate with controlled low differential pressure. This pneumatic device configuration enables effective fluid suction through optimized airflow dynamics rather than relying on high pressure differential, thus preventing substrate adhesion while maintaining suction effectiveness.
2Power
If high differential pressure is used for suction, then suction power is improved, but fluid suction uniformity deteriorates
Solution Approach 1:
The invention transforms the suction approach by using high volume flow rate with low differential pressure instead of high differential pressure. This parameter change ensures uniform fluid suction across the substrate surface, as the high flow velocity distributes suction forces more evenly without the localized excessive pressure that causes non-uniform suction under high differential pressure conditions.
3Productivity
If suction nozzle openings are positioned close to transport rollers, then fluid collection is optimized, but device complexity increases
Solution Approach 1:
The suction device is segmented into multiple suction lances with suction nozzle openings positioned at different locations. This segmentation allows the nozzles to be strategically placed close to transport rollers for optimized fluid collection, while the modular structure manages the complexity through distributed, independent suction units rather than a single complex configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved suction behavior and etching processes by maintaining high suction flow rates with minimal substrate adhesion, unaffected by fluid density variations, and allows for efficient separation of liquids from gases, enhancing overall etching efficiency.
Implementation Method 1
a suction source 14, a suction control unit 15 for driving the suction source 14 and a suction tube unit 16 connected to the suction source 14, which has at least one suction lance 16, which can be positioned with one or more intake-side suction nozzle openings 19 at a suction distance from the treatment surface
Implementation Method 2
The suction source 14 and the suction control unit 15 of the suction device are designed for a suction volume flow per suction lance 16 of at least 30m3/h and a suction negative pressure of no more than 8kPa
Implementation Method 3
an etching fluid reservoir 5 and etching fluid conveying means for conveying the etching fluid from the etching fluid reservoir to the treatment surface
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to an extracting device for extracting a treatment fluid from a substantially planar treatment surface (3a) of treatment substrates (3) transported by means of transporting rollers (8, 10) along a substantially horizontal transporting direction, comprising a suction source, an extraction control unit activating the latter, and an extraction tube unit connected to the suction source and having at least one extraction lance, which can be positioned with one or more inlet-side extraction nozzle openings at an extracting distance from the treatment surface. The invention also relates to an etching device equipped with such an extracting device. In the case of an extracting device according to the invention, the suction source and the extraction control unit are designed for a suction volume flow for each extraction lance of at least 30 m3/h and a suction vacuum of no more than 8 kPa. In addition or as an alternative, the extraction lance has a comb-like extraction structure with an extraction collecting tube (17) and a number of extraction tubes (18) that extend from the extraction collecting tube in a comb-like manner and have the extraction nozzle openings (19) on the inlet side. Use for example for etching printed circuit boards, conductor films or semiconductor wafers.