Wiring Board UV Curing via Selective Light Amounts
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing wiring boards are inefficient due to the need for prolonged UV light application on multiple layers, which increases manufacturing time and energy consumption.
Innovation Solution
A wiring board manufacturing method that alternates between applying UV-curable resin layers and conductive wiring layers, using a higher integral light amount for the resin layer below the wiring layer and a lower integral light amount for subsequent resin layers, and a device comprising UV-curable resin ink application, UV light emission, conductive ink application, and laser light emission to achieve efficient layer building and wiring formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If UV light is applied with sufficient integral light amount to each resin layer to ensure complete hardening, then the resin layer quality is improved, but the total manufacturing time increases significantly
Solution Approach 1:
The patent applies UV light with a first integral light amount (excessive action) only to the resin layer directly below the wiring layer to ensure complete hardening where it is most critical. For other resin layers, a second integral light amount (partial action) that is smaller is used. This selective application of different light amounts resolves the contradiction by providing sufficient hardening only where necessary while reducing overall exposure time.
Solution Approach 2:
The patent implements local quality by differentiating UV light application based on position and function: the resin layer beneath the wiring layer receives a first integral light amount (higher quality hardening) to ensure proper adhesion and structural integrity, while other resin layers receive a second integral light amount (standard hardening). This localized differentiation of hardening quality resolves the time-quality contradiction.
2Reliability
If conventional UV curing is used for each layer sequentially, then complete hardening is achieved, but the wiring board manufacturing efficiency decreases
Solution Approach 1:
The patent applies partial action by using a reduced second integral light amount for resin layers that do not require maximum hardening, and excessive action with a first integral light amount only for the critical resin layer beneath the wiring layer. This selective approach maintains hardening completeness where needed while improving overall manufacturing efficiency.
Solution Approach 2:
The patent changes the UV light parameter (integral light amount) based on the specific requirements of different resin layers. By adjusting the light amount parameter - using a first integral light amount for the critical layer and a second integral light amount for other layers - the patent achieves both complete hardening and improved productivity.
3Reliability
If UV light with high integral light amount is applied to all resin layers, then all layers are completely hardened, but the energy consumption increases
Solution Approach 1:
The patent applies local quality by providing higher energy (first integral light amount) only to the resin layer directly below the wiring layer where complete hardening is critical for adhesion and structural integrity. Other resin layers receive lower energy (second integral light amount), reducing total energy consumption while maintaining sufficient hardening quality.
Solution Approach 2:
The patent uses excessive action (first integral light amount) selectively only where necessary for critical hardening, and partial action (second integral light amount) for other layers. This reduces overall energy consumption while ensuring reliability where it matters most.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces overall UV light application time and energy usage while ensuring the resin layer beneath the wiring layer is fully hardened, enhancing conductivity and manufacturing efficiency.
Implementation Method 1
forming a resin layer by applying a UV-curable resin ink and applying UV light to the applied resin ink
Implementation Method 2
forming a wiring layer by applying a conductive ink on the resin layer and applying a laser light or a pulse light including a continuous spectrum to the applied conductive ink
Data Source
AI summary
A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.