Component Carrier Shielding Cage for EMI Suppression
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Solution Overview
Problem
Conventional electronic component packaging solutions are inadequate in addressing electromagnetic interference (EMI) issues, particularly in compact form factors with increasing operating frequencies, as they fail to effectively shield electromagnetic radiation between embedded components on the same circuit board.
Innovation Solution
An electronic device with a component carrier that incorporates a shielding cage surrounding the electronic components, formed from electrically conductive materials as part of the component carrier, providing efficient electromagnetic interference suppression without requiring additional external shielding, thus allowing for compact and reliable operation at high frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional mold compound packaging is used, then compact form factor is achieved, but electromagnetic interference suppression is insufficient
Solution Approach 1:
The shielding cage is merged with the component carrier to form an integrated structure. The component carrier includes a base plate and side walls that together form a cage-like enclosure, eliminating the need for separate shielding components while providing EMI suppression for embedded electronic components.
Solution Approach 2:
The component carrier serves multiple functions: it provides mechanical support for embedding electronic components, provides electrical connection through conductive elements, and provides electromagnetic shielding. This multi-functionality reduces the need for additional separate components.
2Object-affected harmful factors
If shielding cage is added as separate component, then electromagnetic interference suppression is improved, but device complexity and size increase
Solution Approach 1:
The shielding cage is merged with the component carrier to form an integrated structure. The component carrier includes a base plate and side walls that together form a cage-like enclosure, eliminating the need for separate shielding components while providing EMI suppression for embedded electronic components.
3Reliability
If conventional packaging is used, then manufacturing simplicity is maintained, but electromagnetic interference causes component failure at high frequencies
Solution Approach 1:
The shielding cage is merged with the component carrier to form an integrated structure. The component carrier includes a base plate and side walls that together form a cage-like enclosure, eliminating the need for separate shielding components while providing EMI suppression for embedded electronic components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses electromagnetic interference, enabling failure-free operation of electronic components at high frequencies while maintaining a compact size, using standard circuit board materials and processes, and preventing both inter- and intra-device electromagnetic distortions.
Implementation Method 1
a component carrier (i.e. a carrier structure in and/or on which one or more electronic components may be mounted) in which the electronic component is packaged or embedded, wherein the component carrier comprises (i.e. as part of the component carrier rather than as a separate member) a shielding cage surrounding all sides of the electronic component at least partially
Data Source
AI summary
An electronic device having an electronic component with electric terminals and a component carrier in which the electronic component is packaged. The component carrier includes a shielding cage surrounding all sides of the electronic component at least partially.