Carrier Structure Build-Up Circuit Endpoint Detection
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Solution Overview
Problem
During the manufacturing of single-sided fine line redistribution layers on a carrier, the endpoint of a circuit is hidden, making it difficult to detect short-circuit or open-circuit issues, especially when the problem occurs near the endpoint.
Innovation Solution
A carrier structure with a build-up circuit layer and through holes, where the first pad is exposed through the holes, allowing for electrical connection and detection at both endpoints, including the use of a connecting layer, conductive pads, and conductive pillars to enhance connectivity and detection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the circuit endpoint is hidden between the redistribution layer and the carrier, then the structure is compact and manufacturing is simplified, but the ability to detect short-circuit or open-circuit issues at the endpoint is lost
Solution Approach 1:
The patent introduces a connecting layer as an intermediary component between the carrier and the build-up circuit layer. This connecting layer includes conductive pads that extend through the carrier, allowing electrical connection to the circuit endpoint while maintaining the compact structure. The intermediary enabling detection without compromising manufacturing simplicity
Solution Approach 2:
The patent extends the detection capability to another dimension by routing conductive pads through the carrier substrate. Instead of keeping the endpoint hidden in a single plane, the solution creates a three-dimensional detection path that allows access to the endpoint through the carrier thickness, enabling detection while maintaining structural compactness
2Manufacturing precision
If the circuit is fine and an open circuit occurs near the hidden endpoint, then the circuit design achieves high integration, but the manufacturing process problems cannot be detected
Solution Approach 1:
The connecting layer with conductive pads serves as an intermediary detection interface that allows verification of fine circuit connections without compromising the circuit's integrated design. The mediators enable reliability verification while maintaining manufacturing precision
Solution Approach 2:
The patent implements preliminary detection capability by providing access to the circuit endpoint before final product completion. The conductive pads are prepared in advance within the connecting layer, enabling early detection of manufacturing issues in fine circuits while maintaining their precision design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable short-circuit or open-circuit detection on both endpoints of the build-up circuit layer, improving the detection of manufacturing process issues and ensuring the carrier substrate's reliability.
Implementation Method 1
the connecting layer is made of a material including an anisotropic conductive adhesive
Data Source
AI summary
A manufacturing method of a carrier structure includes: A build-up circuit layer is formed on a carrier. The build-up circuit layer includes at least one first circuit layer, at least one first dielectric layer, a second circuit layer, a second dielectric layer, and a plurality of conductive vias. The first circuit layer is located on the carrier and includes at least one first pad, which is disposed relative to at least one through hole of the carrier. The first dielectric layer is located on the first circuit layer. The second circuit layer is located on the first dielectric layer and includes at least one second pad. The second dielectric layer is located on the second circuit layer and includes at least one opening exposing the second pad. The conductive via penetrates the first dielectric layer and is electrically connected to the first circuit layer and the second circuit layer.