Printed Circuit Aspects TRIZ Cases

Roughening the adhesion insulating layer prevents electroless plating bulges and enables narrow pitch wiring patterns.

A sealing member fills the gap between engaged circuit board connectors to block moisture ingress and maintain electrical integrity.

Electrodeposited copper foil achieves high mechanical strength and elongation while eliminating lubricating oil contamination from rolling processes.

Modified phosphazene in a halogen-free resin composition resolves the contradiction between flame retardation and signal transmission quality.

Integrating LEDs into a printed circuit board with resin material reduces material costs and improves heat dissipation efficiency in backlight units.

High molecular weight dimer diamine in polyimide precursors lowers dielectric constant and loss tangent while maintaining solvent insolubility.

A flexible circuit board structure uses electroplated seed layers to form patterned conductive pathways on a substrate.

Wrapping a flexible circuit board around an inductor body reduces module thickness below 3 mm while accommodating more components.

Cutting the reinforced fiber cloth at a 5 to 30 degree angle prevents fuzzing and reduces fiber waste during manufacturing.

Merging the heat sink and mounting substrate into one base reduces handling difficulty while maintaining thermal management.

A terahertz radiation emitter and receiver measure electric field amplitude to determine ink conductivity values.

Pattern plating deposits copper vias in a polymer matrix, replacing laser drilling to resolve throughput and cost bottlenecks.

A liquid crystal display shield unit uses a pem-nut and bolt structure to secure components at precise positions.

Second reinforcing portions overlap first member areas to counter thermal expansion differences, preventing warping in flexible wiring structures.

Differential thermal expansion in layered insulating materials reduces warp during high-density interconnect manufacturing.

An acidic electrolyte with Mn(II) ions forms a conductive polymer for copper plating, reducing solution waste and increasing throughput.

Optimized alumina-zirconia composition increases thermal conductivity to 25 W/mK while maintaining bending strength above 500 MPa.

Bottom-mounted contacts orient resonator holes normal to the board, achieving symmetrical excitation that improves stopband attenuation.

Symmetric cavities in the substrate equalize thermal stress, preventing cracks and disconnection during heat contraction.

An alignment soldering leg joins the connector to the board, resolving assembly deviation and improving current distribution.

A combined plastic injection and metal casting process produces a component carrier with an integrated conductor structure.

A thermally conductive structure absorbs heat from high-performance processors and dissipates it through vias in the insulating layers.

Metallic atoms precipitate from metal-organic compounds within the resin body to form conductive paths, enabling fine pitch wiring on flexible substrates.

Applying a protective layer to the stack surface prevents grinding damage while enabling efficient removal of excess filling medium from multiple holes.

Concentric curved dipoles and a polarization synthesis network resolve manufacturing difficulties while maintaining wide bandwidth and high polarization purity.

A flexible rectangular bus bar assembly uses a high width-to-thickness ratio strip for efficient heat dissipation.

Varied flexible circuit board distances distribute stress to prevent peeling during curved display manufacturing.

Imidazolyl polyamic acid in photosensitive resin provides heat resistance and bending properties without brominated flame retardants.

A wiring substrate uses a two-layer insulating structure with distinct filler contents to manage thermal expansion differences between layers.

Segmented housing ribs guide airflow through a PCB level divider, preventing insect penetration without disconnecting electrical connections.

A connector body holds signal terminals and accepts a removable circuit board with conductive pads for electrical contact.

Composite conductive paste with molten metal and active particles bonds ceramic substrates in nitrogen atmosphere.

Inorganic particles with flat exposed portions create a smooth resin insulating layer surface, enabling continuous seed layer growth while preventing peeling.

A flexible printed circuit board features a folding back portion housed within the backlight unit's rear case aperture.

A glass carrier copper foil uses selective release layer deposition to create unreleasable edge regions.

Laminating a flexible printed circuit to a bent metal stiffener secures component mounting positions within electronic enclosures.

Integrating a helical inductive coil via conductive pillars eliminates surface mount soldering challenges, reducing package size while improving reliability.

An embedded module design reduces substrate area while enhancing heat dissipation through vertical stacking.

A carrier structure exposes circuit pads through holes to enable electrical connection and detection at both endpoints.

Antimony-doped tin oxide enables laser direct structuring on light-colored thermoplastic circuit carriers.

Thermally decomposable cyanoacrylate coating prevents solder powder oxidation while reverting to monomers during reflow to maintain electrical conductivity.

Batch-bonding ceramic and circuit boards via a pre-formed adhesive part reduces thermal stress deformation and shortens production time.

A flippable electrical connector uses diagonal contact arrangements to enable dual orientation insertion.

Slot-fitting projections on an insulating cover isolate high voltage components, resolving unequal voltage distribution across series-connected diodes.

Compressing particles in anisotropic films joins threads to boards, eliminating rigid solder joints that break under bending stress.

A board-to-board connector spring part secures elastic deformation through segmented structural design.

Composite conductive paste and resin adhesive layers reduce thickness while maintaining flexibility to minimize signal distortion.