Printed Circuit Aspects TRIZ Cases
- Wiring Substrate Adhesion Insulating Layer Roughening
Roughening the adhesion insulating layer prevents electroless plating bulges and enables narrow pitch wiring patterns.
- Sealed Circuit Board Connectors Waterproofing
A sealing member fills the gap between engaged circuit board connectors to block moisture ingress and maintain electrical integrity.
- Electrodeposited Copper Foil Surface Roughness Control
Electrodeposited copper foil achieves high mechanical strength and elongation while eliminating lubricating oil contamination from rolling processes.
- Halogen-Free Resin Composition for Low Dielectric Circuit Boards
Modified phosphazene in a halogen-free resin composition resolves the contradiction between flame retardation and signal transmission quality.
- Integrated PCB LED Module for Backlight Heat Dissipation
Integrating LEDs into a printed circuit board with resin material reduces material costs and improves heat dissipation efficiency in backlight units.
- Polyimide Precursor Dimer Diamine High Frequency PCB
High molecular weight dimer diamine in polyimide precursors lowers dielectric constant and loss tangent while maintaining solvent insolubility.
- Flexible Circuit Board Seed Layer Electroplating
A flexible circuit board structure uses electroplated seed layers to form patterned conductive pathways on a substrate.
- Electronic Module With Inductor-Wrapping Circuit Board
Wrapping a flexible circuit board around an inductor body reduces module thickness below 3 mm while accommodating more components.
- Printed Wiring Board Cutting Angle for Fiber Waste Reduction
Cutting the reinforced fiber cloth at a 5 to 30 degree angle prevents fuzzing and reduces fiber waste during manufacturing.
- LED Module Base with Insulative Layer and Connecting Flange
Merging the heat sink and mounting substrate into one base reduces handling difficulty while maintaining thermal management.
- Terahertz Testing Printed Metamaterial Conductivity
A terahertz radiation emitter and receiver measure electric field amplitude to determine ink conductivity values.
- Interposer Frame Polymer Matrix Via Fabrication
Pattern plating deposits copper vias in a polymer matrix, replacing laser drilling to resolve throughput and cost bottlenecks.
- LCD Shield Unit Fixing Structure for Thin Display Assembly
A liquid crystal display shield unit uses a pem-nut and bolt structure to secure components at precise positions.
- Flexible Member Reinforcing Structure for Warping Control
Second reinforcing portions overlap first member areas to counter thermal expansion differences, preventing warping in flexible wiring structures.
- Wiring Board Insulating Layer Design for Warp Reduction
Differential thermal expansion in layered insulating materials reduces warp during high-density interconnect manufacturing.
- Electrolytic Copper Metallization on Dielectric Substrates
An acidic electrolyte with Mn(II) ions forms a conductive polymer for copper plating, reducing solution waste and increasing throughput.