Multi-layer PCB Batch-bonding Ceramic and Circuit Boards
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Solution Overview
Problem
The existing methods for manufacturing multi-layer printed circuit boards face challenges in achieving even layer implementation and prolonged production times due to thermal stress and repeated thermal bonding processes, which cause deformation and increase turnaround time.
Innovation Solution
A multi-layer printed circuit board manufacturing method involving a ceramic board, a printed circuit board, and an adhesive part with a conductive paste, where the adhesive part is used to connect and batch-bond these components, minimizing thermal bonding processes and allowing for simultaneous thermal processing in the final stage, thus reducing production time and alleviating deformation issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If repeated thermal bonding processes are performed to manufacture each layer sequentially, then the multi-layer printed circuit board can be manufactured with proper layer bonding, but the production period is lengthened and deformation occurs due to thermal stress
Solution Approach 1:
Multiple layers are bonded simultaneously in a single thermal bonding process rather than sequentially. The adhesive parts are pre-formed with conductive paste, and all layers are stacked and bonded together at once, merging multiple bonding operations into one unified process that reduces production time while maintaining bonding quality
Solution Approach 2:
Adhesive parts are prepared in advance with conductive paste filled into the adhesive layers before the final assembly. This preliminary preparation of adhesive parts with pre-formed conductive pathways allows the main bonding process to proceed quickly without requiring sequential conductive paste application and curing for each layer
2Reliability
If repeated thermal bonding processes are performed to manufacture each layer sequentially, then the multi-layer printed circuit board can be manufactured with proper layer bonding, but deformation occurs due to thermal stress from coefficient of thermal expansion differences
Solution Approach 1:
All layers are bonded simultaneously in one thermal bonding process, experiencing thermal stress at the same time rather than sequentially. This unified approach ensures uniform thermal expansion across all layers, preventing cumulative deformation and maintaining layer evenness while achieving proper bonding
Solution Approach 2:
Adhesive parts with conductive paste are strategically placed at specific locations where bonding and electrical connection are needed. This localized approach allows precise control of thermal and electrical properties at critical interfaces while maintaining overall structure integrity
3Adaptability or versatility
If the number of circuit layers is increased to expand text channels, then the device integration is improved, but the turn-around time and manufacturing difficulty increase
Solution Approach 1:
Multiple layers are assembled and bonded simultaneously in a single process step, allowing high-layer-count boards to be manufactured without proportionally increasing production time. This parallel processing approach maintains productivity even as circuit complexity and layer count increase
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables even layer implementation and significantly shortens the production period of multi-layer printed circuit boards by reducing thermal processes, thereby improving manufacturing efficiency and reducing deformation caused by thermal stress.
Implementation Method 1
a conductive paste filled in an inside of the adhesive part opening
Implementation Method 2
an adhesive layer including an adhesive material
Data Source
AI summary
A circuit board including an adhesive part, a ceramic board part with the adhesive part, and a printed circuit board part with the adhesive part. The ceramic board and printed circuit board parts are made of different materials. The adhesive part includes: an adhesive layer including an adhesive material, an adhesive part opening, and a conductive paste filled in an inside of the adhesive part opening.A method including providing a ceramic board part, providing a printed circuit board part, and producing an adhesive part. Batch-bonding the printed circuit board part, the adhesive part, and the ceramic board part with one another. Producing the adhesive part includes: bonding a protection layer on two surfaces of an adhesive layer, forming an adhesive part opening penetrating the adhesive layer and the protection layer, filling the adhesive part opening with a conductive paste, and removing the protection layer.