Conductive Adhesive Layer for Flexible Display Wiring
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Solution Overview
Problem
Current display devices, such as LCDs and AMOLEDs, face challenges like slow response time, short lifespan, and limited flexibility, while semiconductor light emitting devices struggle with reliable electrical connections and fine pitch wiring.
Innovation Solution
A flexible display device is developed with a wiring substrate and semiconductor light emitting devices connected via a conductive adhesive layer containing a resin with metallic aggregation parts formed from metal-organic compounds, enabling reliable electrical connections and fine pitch wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection methods are used between wiring substrate and semiconductor light emitting devices, then manufacturing process is simple, but electrical connection reliability is poor
Solution Approach 1:
The conductive adhesive layer combines resin material (for adhesion and flexibility) with metallic aggregation parts (for electrical conductivity), creating a composite material that simultaneously provides mechanical bonding and electrical connection. This resolves the contradiction by integrating multiple functions into a single layer, improving reliability without proportionally increasing structural complexity.
Solution Approach 2:
The conductive adhesive layer acts as an intermediary between the wiring substrate and semiconductor light emitting devices, providing both mechanical adhesion and electrical conductivity. This mediator approach allows reliable electrical connections while maintaining manufacturing feasibility, as the intermediary layer can be applied through conventional coating processes.
2Manufacturing precision
If fine pitch wiring is implemented, then imaging resolution is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces traditional mechanical wiring structures with a conductive adhesive layer that can be applied through coating processes. This substitution allows fine pitch wiring patterns to be achieved more easily, as the adhesive layer can conform to fine features without requiring high-precision mechanical alignment and bonding operations.
Solution Approach 2:
By changing the material parameters of the connection layer (using a conductive adhesive with appropriate viscosity and curing characteristics), the patent enables fine pitch wiring to be manufactured with standard precision equipment. The material properties are optimized to work with fine features, reducing the stringency of manufacturing precision requirements.
3Adaptability or versatility
If flexible display structure is implemented, then adaptability is improved, but electrical connection stability deteriorates
Solution Approach 1:
The conductive adhesive layer is implemented as a thin, flexible film that can accommodate bending and deformation of the display structure. This flexible connection layer maintains electrical stability even when the display is flexed, resolving the contradiction between flexibility and connection stability by using a connection structure that inherently tolerates mechanical deformation.
Solution Approach 2:
The composite nature of the conductive adhesive (resin + metallic aggregation) provides both flexibility and electrical stability. The resin component provides mechanical flexibility and adhesion, while the metallic aggregation maintains electrical conductivity, enabling the connection to remain stable even when the flexible display is bent or deformed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a flexible display with improved electrical reliability and high-resolution imaging capabilities, addressing the limitations of existing technologies by ensuring stable connections and efficient light emission from semiconductor light emitting devices.
Implementation Method 1
a metallic aggregation part disposed in the body, and formed as metallic atoms precipitated from a metal-organic compound are aggregated with each other
Implementation Method 2
a conductive adhesive layer configured to electrically connect the wiring electrode with the plurality of semiconductor light emitting devices
Data Source
AI summary
A display device including a wiring substrate having a wiring electrode; a plurality of semiconductor light emitting devices which form pixels; and a conductive adhesive layer configured to electrically connect the wiring electrode with the plurality of semiconductor light emitting devices. Further, the conductive adhesive layer includes a body provided with a resin having an adhesive property; and a metallic aggregation part disposed in the body, and formed as metallic atoms precipitated from a metal-organic compound and aggregated with each other.