Integrated PCB LED Module for Backlight Heat Dissipation
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Solution Overview
Problem
Current liquid crystal display (LCD) backlight units are costly and inefficient in heat emission, requiring separate light sources and packages that increase material costs and reduce heat dissipation efficiency.
Innovation Solution
A light emitting module integrated with a printed circuit board (PCB) featuring holes for light emitting diodes and resin material, which reduces material costs and enhances heat emission by using a PCB as a mounting surface for LEDs and improving optical efficiency with lenses and a metal layer for thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate light sources and packages are used in backlight units, then device functionality is achieved, but material costs increase and heat dissipation efficiency decreases
Solution Approach 1:
The patent combines the PCB and LED package into a single integrated structure where the LED is mounted directly on the PCB without a separate package. The PCB serves dual functions as both the electrical circuit board and the heat dissipation structure, eliminating the need for separate packaging materials and reducing overall material costs while improving thermal management efficiency.
Solution Approach 2:
The PCB is designed to perform multiple functions simultaneously: it provides electrical connections for the LED, serves as a mechanical support structure, and acts as a heat dissipation pathway. This multi-functionality eliminates the need for separate components for each function, reducing material costs and simplifying the overall structure.
2Loss of energy
If LEDs are mounted on a PCB with holes and resin material, then heat emission efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent integrates the mounting structure, heat dissipation pathway, and electrical connection system into a single PCB-LED assembly. The holes in the PCB serve both as mounting positions for the LED and as channels for heat dissipation, while the resin material simultaneously provides electrical insulation and thermal management. This integration reduces the number of separate manufacturing steps and components.
3Ease of manufacture
If a PCB is used as a mounting surface for LEDs, then material costs are reduced, but heat dissipation requirements become more critical
Solution Approach 1:
The PCB is designed to serve as both the electrical circuit board and the primary heat dissipation structure. By integrating the heat dissipation function into the PCB itself rather than requiring separate heat sinks or cooling components, the patent reduces material costs while ensuring that heat dissipation requirements are met through the PCB's inherent thermal conductivity and structural design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces material costs and improves heat emission efficiency by integrating LEDs with the PCB, enhancing light emission and heat dissipation in the backlight unit, thereby optimizing the performance of the display apparatus.
Implementation Method 1
a light emitting diode disposed in the hole
Implementation Method 2
a resin material disposed in the hole
Implementation Method 3
the module board includes a printed circuit board (PCB) having a photo solder resist (PSR) layer, an electrical conduction layer, and an insulation layer
Data Source
AI summary
Provided is a light emitting module, which includes a module board, at least one light emitting diode, a metal layer and a resin material. The module board includes a photo solder resist (PSR) layer, an electrical conduction layer under the PSR layer, an insulation layer under the electrical conduction layer, and a plurality of diode holes passes through the PSR layer, the electrical conduction layer, and the insulation layer. The light emitting diode is disposed inside the plurality of diode holes and is contacted to the metal layer exposed through the plurality of diode holes.